[Exhibition Recap] Breaking Traditional Limits in IGBT & SiC Pre-Sintering Packaging

The 3-day 2024 NEPCON ASIA Electronics Show has come to an end.

We sincerely thank every customer and friend who visited and supported us.

Now, let’s look back at the exhibition and relive some of the exciting moments!

Driving Innovation with One-Stop Solutions

Complete Pre-Sintering Die Bonding Solutions to Tackle Demanding Challenges

High-Precision Die Bonders

01. PNP6600EVO Multi-Functional Die Bonder
multi-modular configurations support a wide range of bonding processes, delivering a multifunctional solution for the semiconductor industry. The machine supports dispensing, dipping, flip-chip, heating, and UV processes.
XY placement accuracy: ±3–10μm @ 3σ; rotation accuracy: ±0.1° @ 3σ.

02. PNP6600EVOa Eutectic Die Bonder
Designed for eutectic bonding, this machine features adjustable temperature control for the suction nozzles and platform, and operates in an inert gas environment. It supports both standard and friction eutectic bonding, reducing solder voids (empty spaces) through fine-tuned process parameters.
XY placement accuracy: ±7μm @ 3σ; rotation accuracy: ±0.1° @ 3σ.

03. PNP6600EVOc Pre-Sintering Die Bonder
Optimized for IGBT applications, this model supports both silver film transfer and silver paste process. adjustable temperature control for the suction nozzles and platform ensures consistent chip and substrate temperatures, while the inert atmosphere enables reliable pre-sintering.
XY placement accuracy: ±7μm @ 3σ; rotation accuracy: ±0.1° @ 3σ.

04. PNP6600EVOf Flip-Chip Die Bonder
Engineered for a range of flip-chip packaging processes, including flip reflow and ultrasonic bonding. Equipped with 180° automatic chip flipping, flux dipping capability, and an air-bearing high-precision placement head.
XY placement accuracy: ±5μm @ 3σ; rotation accuracy: ±0.1° @ 3σ.

This successful exhibition owes much to the support of all guests and clients. Looking forward to expanding and deepening future cooperation.

Top Leading will continue to focus on smart equipment, helping clients to transition from platform-based to digital and intelligent manufacturing.