[Live from the Exhibition] Top Leading at the 25th China International Optoelectronic Exposition

As China's premier exhibition covering the entire optoelectronic industry chain, the 25th China International Optoelectronic Exposition (CIOE) served as Top Leading's autumn rendezvous with industry partners

Top Leading @ CIOE China Optoelectronic Expo

September 11-13, 2024

Shenzhen International Convention and Exhibition Center - Hall 10

Booth Number: 10D23

Exhibition Highlights

At this CIOE China Optoelectronics Expo, Top Leading will showcase and share solutions from three major areas, including:

High-Precision Bonding Solutions

Advanced AOI Solutions for Ceramic Substrate Inspection

Testing and Sorting Solutions for Micro Components

In-Depth Showcase

As a leading innovator, Top leading presents a series of multifunctional high-precision die bonders that cover over 90% of the market’s die bonding process needs, including multi-chip standard, flip-chip, eutectic, and pre-sintering bonding all with a 100% process match rate.
These machines, the first in China to achieve key technological breakthroughs, have earned multiple national invention patents.

Also showcased are ultra-micro component testing and sorting platforms with detection accuracy up to 1μm and minimum device sizes as small as 0.25mm × 0.125mm, alongside ultra-high precision AOI equipment for ceramic substrates together advancing domestic alternatives.

Live Highlights

High-Precision Die Bonders

PNP6600EVOad High-Precision Multi-Functional Die Bonder: Designed for the optical communications field and Chiplet technology, this bonder meets extremely high precision and functionality requirements. It achieves XY placement accuracy of ±4μm @ 3σ and rotation accuracy of ±0.1° @ 3σ. Equipped with a transfer platform for positioning and high-precision industrial camera recognition, it holds multiple invention patents.

PNP6600EVOa Eutectic Die Bonder: Engineered for precision eutectic bonding, this system features independently controlled heating for both suction nozzles and transfer platform within an inert gas environment. It supports standard and friction eutectic processes, with customizable parameters to minimize solder voids, achieving ±7μm XY placement accuracy and ±0.1° rotation accuracy (3σ).

PNP6600EVOc Pre-Sintering Die Bonder: Optimized for IGBT applications, this bonder is compatible with both silver film transfer and silver paste processes. Independent temperature control of the suction nozzles and platform maintains consistent substrate and chip temperatures within an inert gas environment, enabling reliable chip pre-sintering. XY placement accuracy: ±7μm @ 3σ; rotation accuracy: ±0.1° @ 3σ.

PNP6600EVOf Flip-Chip Die Bonder: Designed for flip-chip bonding, it supports reflow and ultrasonic soldering. Features include 180° automatic chip flipping, flux dipping, and an air-bearing high-precision placement head. Placement accuracy: ±5μm @ 3σ; rotation accuracy: ±0.1° @ 3σ.

PNP6600EVO Multi-Functional Die Bonder: Modular design supports various bonding processes including dispensing, dipping, flip-chip, heating, and UV curing, providing versatile solutions for the semiconductor industry. Placement accuracy: ±7μm @ 3σ; rotation accuracy: ±0.1° @ 3σ.

Ceramic Substrate Ultra-High Precision AOI

EC01 Visual Inspection Machine: Suitable for LTCC, HTCC, MLCC, and other green ceramic tape products before sintering. It inspects hole quality, hole filling, print quality, and measures dimensions. Features high efficiency, inspecting a 150mm product in approximately 25 seconds.

EC02 Visual Inspection Machine: Suitable for thin-film integrated circuits, thick-film integrated circuits, DPC, DBC, AMB, ceramic packages, and more. It detects circuit surface defects and coating thickness. Notable for strong compatibility with various material types.

EC03 Visual Inspection Machine: Suitable for DPC, thin-film integrated circuits, resistor substrates, AMB, DBC, etc. It inspects circuit surface defects and coating thickness. Supports simultaneous double-sided inspection and multiple marking methods.

EC06 Visual Inspection Machine: Suitable for QFN, DFN, BGA, image modules, packages, and more. Performs wire bond gold wire inspection and supports various carrier types, including lead frames, steel carriers, and aluminum carriers. Features cross-line and arc detection capabilities, ultra-large depth fusion technology, and supports inspection of stacked dies and multi-level height differences in bonding wires.

Ultra-Micro Component Test & Sorting Platform

Conducts visual appearance and electrical performance inspections of tiny passive and active components, and completes final packaging. Works with a standard turret design and diverse testing systems to support inspection needs of various discrete components.

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Achieves detection accuracy up to 1μm and supports devices as small as 0.25mm × 0.125mm.

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Measures resistance up to 1TΩ (10^12Ω) and performs nondestructive 0.3μm contact area testing at frequencies above 100GHz within a 1MHz bandwidth.

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Testing, inspection, and sorting systems are in-house developed and managed by Top Leading.