Products
Top-Leading Intelligent Technology delivers advanced semiconductor assembly and test equipment engineered for high-precision production, repeatable yields, and full production-line integration. Our product family — including high-speed die bonders, automated optical inspection (AOI) systems, test handlers, tri-temperature handlers and precision press-fit machines — is designed for demanding markets such as advanced packaging, memory, power modules, RF/microwave and optical modules.
Built for throughput and micron-level accuracy, our die bonders and flip-chip systems support multi-head and multi-nozzle configurations, stack bonding and eutectic/epoxy processes to meet both high-volume production and specialty, high-precision assembly requirements. Machines with vibration suppression, air-bearing force control and multi-stage temperature profiles enable placement accuracy and thermal control that advanced packaging and photonics customers require.
Quality and defect prevention are core to our portfolio: our AOI and inspection platforms integrate high-resolution optics, 3D profilometry and AI-enhanced inspection algorithms to detect micro-defects, solder and coating issues early — dramatically cutting rework and boosting first-pass yield. Combined with precision test handlers and burn-in solutions, customers achieve a tightly controlled, end-to-end production flow.
• Proven machine families for both high throughput (thousands of UPH) and ultra-precision placements.
• Flexible process support — eutectic, epoxy, flip-chip and multi-layer dispensing — so one platform can serve multiple product lines.
• Turnkey integration expertise: vision-based placement, inline AOI, and handler/test systems that reduce cycle time and simplify traceability.
Explore our models and request a process evaluation to see how our Semiconductor Packaging Equipment can cut costs, increase yield, and scale with your roadmap. For inquiries and tailored solutions, contact Top-Leading Intelligent Technology!
High-speed stacked chip die bonder PNP 7000M
FEATURES:
PNP7000M supports both single-head and dual-head production and performs fully automatic placement.
With a high-speed motion axis and vibration suppression design, the machine can reach up to 6000 UPH. For bonding processes that take 1 second,it can achieve an efficiency of over 2400 UPH.
Achieves high-precision stacking and bonding of ±7um globally and stack up to 32 layers of chips, meeting your needs for high-precision and high-speed thin die stacking and bonding.
FEATURES:
Adaptable Eutectic Bonding System with Multi-Stage Temperature Control .(pre-heating/heating/cooling)
Eutectic process inert gas anti-oxidation solution
Optimized bond head enable larger die support while maximizing production capacity
Bond different-sized dies with precision using standard and flip-chip bonding solutions, featuring up to seven nozzles and five ejector pins for unmatched efficiency and flexibility.
Full automation: support automatic loading and production line
Improve force control accuracy and stability: Air-bearing structure in the center eliminates friction, awarded an invention patent
Multi-functional Die Bonder PNP 6600 EVO
FEATURES:
Compatible with dot dispensing and dip glue methods using pneumatic, piezoelectric, or screw valve configurations
Supports up to five dip glue heads with automatic switching (epoxy resin, silver paste)
Automatically switches between fourteen nozzles and five ejector pins to handle various chip/die sizes; supports both standard and flip-chip bonding for enhanced flexibility
Multi-layer dispensing capability for complex workflows
Enhanced force control accuracy and stability: Central air-bearing structure eliminates friction; awarded an invention patent
Chip Capacitor Test Handler SC21
FEATURES:
Achieve high-accuracy electrical testing with a wide capacitance range and ultra-low capacitance, with ±0.5% accuracy throughout the process.
Screening high-Q, ultra-low-loss components for critical performance in filters and impedance matching.
Zero surface defects guaranteed (no indentations/scratches on Au coating) during inspection.
High-Precision Detection: Accurately spots surface defects ≥5 μm—such as scratches, pits, discoloration, or particles—as well as coating issues like uneven or missing layers.
Aligns tiny capacitors with ±10μm accuracy to handle small-size challenges.
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Guangzhou Top-leading Intelligent Technology Co.,Ltd
