Achieve a high-precision die bonding of up to ±3μm, meeting your requirements for high precision and multi-functionality in die bonding.
Products
Top-Leading Intelligent Technology delivers advanced semiconductor assembly and test equipment engineered for high-precision production, repeatable yields, and full production-line integration. Our product family — including high-speed die bonders, automated optical inspection (AOI) systems, test handlers, tri-temperature handlers and precision press-fit machines — is designed for demanding markets such as advanced packaging, memory, power modules, RF/microwave and optical modules.
Built for throughput and micron-level accuracy, our die bonders and flip-chip systems support multi-head and multi-nozzle configurations, stack bonding and eutectic/epoxy processes to meet both high-volume production and specialty, high-precision assembly requirements. Machines with vibration suppression, air-bearing force control and multi-stage temperature profiles enable placement accuracy and thermal control that advanced packaging and photonics customers require.
Quality and defect prevention are core to our portfolio: our AOI and inspection platforms integrate high-resolution optics, 3D profilometry and AI-enhanced inspection algorithms to detect micro-defects, solder and coating issues early — dramatically cutting rework and boosting first-pass yield. Combined with precision test handlers and burn-in solutions, customers achieve a tightly controlled, end-to-end production flow.
• Proven machine families for both high throughput (thousands of UPH) and ultra-precision placements.
• Flexible process support — eutectic, epoxy, flip-chip and multi-layer dispensing — so one platform can serve multiple product lines.
• Turnkey integration expertise: vision-based placement, inline AOI, and handler/test systems that reduce cycle time and simplify traceability.
Explore our models and request a process evaluation to see how our Semiconductor Packaging Equipment can cut costs, increase yield, and scale with your roadmap. For inquiries and tailored solutions, contact Top-Leading Intelligent Technology!
PNP6600 Series-Multi-Functional & High-Precision Die Bonder
FEATURES:
Achieve a high-precision die bonding of up to ±3μm, meeting your requirements for high precision and multi-functionality in die bonding.
Chip Capacitor Test Handler SC3021 - IC Test Handler
FEATURES:
This equipment is suitable for visual defect inspection, electrical performance testing, and final packaging of micro components. Adopting a standard turret platform combined with a mature discrete component testing system, it meets the inspection requirements for micro components from various customers.
PNP7000m/PNP7000mpro Series- High-Speed Stacked Chip Die Bonder
FEATURES:
High-speed motion axes with vibration-suppressed technology achieve an industry-leading precision and throughput. Under a 1s pick-and-place cycle, the system achieves a max. capacity of 2,200 UPH, while maintaining an ultra-high accuracy of ±5 µm @ 3σ.
Enabling damage-free production of large dies as thin as 25 µm, the system integrates highly efficient and stable particle removal technology to boost production yield, delivering an consistent and reliable performance even under the extreme complexity of 8-layer die stacking.
PNP7000 LA Series- High-Precision & Micro-Module Die Bonder
FEATURES:
±10μm global die bonding accuracy;
Supports Uplook / Downlook vision positioning;
Ideal for multi-process, high-precision, high-speed micro-module die bonding.
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
