Products
Top-Leading Intelligent Technology delivers advanced semiconductor assembly and test equipment engineered for high-precision production, repeatable yields, and full production-line integration. Our product family — including high-speed die bonders, automated optical inspection (AOI) systems, test handlers, tri-temperature handlers and precision press-fit machines — is designed for demanding markets such as advanced packaging, memory, power modules, RF/microwave and optical modules.
Built for throughput and micron-level accuracy, our die bonders and flip-chip systems support multi-head and multi-nozzle configurations, stack bonding and eutectic/epoxy processes to meet both high-volume production and specialty, high-precision assembly requirements. Machines with vibration suppression, air-bearing force control and multi-stage temperature profiles enable placement accuracy and thermal control that advanced packaging and photonics customers require.
Quality and defect prevention are core to our portfolio: our AOI and inspection platforms integrate high-resolution optics, 3D profilometry and AI-enhanced inspection algorithms to detect micro-defects, solder and coating issues early — dramatically cutting rework and boosting first-pass yield. Combined with precision test handlers and burn-in solutions, customers achieve a tightly controlled, end-to-end production flow.
• Proven machine families for both high throughput (thousands of UPH) and ultra-precision placements.
• Flexible process support — eutectic, epoxy, flip-chip and multi-layer dispensing — so one platform can serve multiple product lines.
• Turnkey integration expertise: vision-based placement, inline AOI, and handler/test systems that reduce cycle time and simplify traceability.
Explore our models and request a process evaluation to see how our Semiconductor Packaging Equipment can cut costs, increase yield, and scale with your roadmap. For inquiries and tailored solutions, contact Top-Leading Intelligent Technology!
Tantalum Capacitor Handler SC25
FEATURES:
Ensure Safety Through Accurate, High-Speed Leakage Current Testing
Smart, multi-protection safety system (current/ESD/fire/shock-proof).
100% power polarity verification (anode/cathode detection)
Full-range voltage testing up to 150V DC for all tantalum capacitors
FEATURES:
Ultra-high-speed and ultra-high-precision basic testing:
Meets automotive (AEC-Q200) and industrial-grade standards.
Wide range of resistance measurements: from 1Ω (min) to 15GΩ (max), covering diverse product types with high precision.
User-defined temperature points for automatic resistance measurement and dynamic high-temperature TCR testing, with a highly stable multi-station temperature control module.
Performs DC withstanding voltage tests to detect breakdown voltage or excessive leakage current.
Pulse withstand testing to screen components with insufficient surge resistance
Verification of a resistor’s nominal power rating under specified conditions – Rated Power Validation
Ceramic Automated Optical Inspection System
FEATURES:
Patented optical system accurately inspects ceramics, metals, and polymers with high reliability.
Custom-engineered ±1µm precision marble platform with linear servo motors supports automatic/manual barcode scanning, ink-dot and laser marking, multi-hole ceramic platform, robotic loading, and full upstream/downstream equipment integration
Smart detection software: DXF one-click programming, AI + traditional dual-mode detection, automatic defect analysis
Automated Wire Bonding & Chip Inspection System EC300PRO
FEATURES:
In-house developed optical system with tunable RGB lighting and dynamic motion-compatible inspection.
Customized platform for inline/offline production, featuring fail-safe feeding, adjustable track height, and modular barcode reading (manual/auto), with inkjet/laser marking
Boost inspection accuracy with AI-driven multi-layer imaging and instant 3D analysis
Offline/online re-inspection system
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Guangzhou Top-leading Intelligent Technology Co.,Ltd
