Semiconductor Machines and Manufacturing Equipment

Top-Leading Intelligent Technology delivers advanced semiconductor assembly and test equipment engineered for high-precision production, repeatable yields, and full production-line integration. Our product family — including high-speed die bonders, automated optical inspection (AOI) systems, test handlers, tri-temperature handlers and precision press-fit machines — is designed for demanding markets such as advanced packaging, memory, power modules, RF/microwave and optical modules.

Built for throughput and micron-level accuracy, our die bonders and flip-chip systems support multi-head and multi-nozzle configurations, stack bonding and eutectic/epoxy processes to meet both high-volume production and specialty, high-precision assembly requirements. Machines with vibration suppression, air-bearing force control and multi-stage temperature profiles enable placement accuracy and thermal control that advanced packaging and photonics customers require.

Quality and defect prevention are core to our portfolio: our AOI and inspection platforms integrate high-resolution optics, 3D profilometry and AI-enhanced inspection algorithms to detect micro-defects, solder and coating issues early — dramatically cutting rework and boosting first-pass yield. Combined with precision test handlers and burn-in solutions, customers achieve a tightly controlled, end-to-end production flow.

Why Choose Top-Leading

• Proven machine families for both high throughput (thousands of UPH) and ultra-precision placements.
• Flexible process support — eutectic, epoxy, flip-chip and multi-layer dispensing — so one platform can serve multiple product lines.
• Turnkey integration expertise: vision-based placement, inline AOI, and handler/test systems that reduce cycle time and simplify traceability.

Explore our models and request a process evaluation to see how our Semiconductor Packaging Equipment can cut costs, increase yield, and scale with your roadmap. For inquiries and tailored solutions, contact Top-Leading Intelligent Technology!

PNP7000M Series- High-Speed Stacked Chip Die Bonder

FEATURES:

High-speed motion axes with vibration-suppressed technology achieve an industry-leading precision and throughput. Under a 1s pick-and-place cycle, the system achieves a max. capacity of 2,200 UPH, while maintaining an ultra-high accuracy of ±5 µm @ 3σ.

Enabling damage-free production of large dies as thin as 25 µm, the system integrates highly efficient and stable particle removal technology to boost production yield, delivering an consistent and reliable performance even under the extreme complexity of 8-layer die stacking.

Explore More

SC6200 Wafer-Level Sorter- For Ultra-Thin Die Sorting

FEATURES:

•UPH: Up to 15K

•Ultra-thin Chip: min 25μm

•Placement Accuracy: 25μm@3σ

•Loading/Unloading Support: 12-inch wafer

Explore More

PNP7000 LA Series- High-Precision & Micro-Module Die Bonder

FEATURES:

±10μm global die bonding accuracy;

Supports Uplook / Downlook vision positioning;

Ideal for multi-process, high-precision, high-speed micro-module die bonding.

Explore More

FCB9900FC Series- High-Speed Flip-Chip Die Bonder

FEATURES:

As large-scale flip-chip reflow soldering processes take a dominant position in IC packaging, we proudly introduce the first domestic solution for dedicated flip-chip packaging equipment, which includes the utilization of advanced motion control and first-class software interaction technologies, achieving high-precision and high-speed flip-chip assembly.

Explore More