Inspection Capa.: ≥0.5 μm;
Accuracy: ≥99.5%;
Inspection Throughput: 3–5 s/pcs;
Vertical large model for optical chips.
Products
Top-Leading Intelligent Technology delivers advanced semiconductor assembly and test equipment engineered for high-precision production, repeatable yields, and full production-line integration. Our product family — including high-speed die bonders, automated optical inspection (AOI) systems, test handlers, tri-temperature handlers and precision press-fit machines — is designed for demanding markets such as advanced packaging, memory, power modules, RF/microwave and optical modules.
Built for throughput and micron-level accuracy, our die bonders and flip-chip systems support multi-head and multi-nozzle configurations, stack bonding and eutectic/epoxy processes to meet both high-volume production and specialty, high-precision assembly requirements. Machines with vibration suppression, air-bearing force control and multi-stage temperature profiles enable placement accuracy and thermal control that advanced packaging and photonics customers require.
Quality and defect prevention are core to our portfolio: our AOI and inspection platforms integrate high-resolution optics, 3D profilometry and AI-enhanced inspection algorithms to detect micro-defects, solder and coating issues early — dramatically cutting rework and boosting first-pass yield. Combined with precision test handlers and burn-in solutions, customers achieve a tightly controlled, end-to-end production flow.
• Proven machine families for both high throughput (thousands of UPH) and ultra-precision placements.
• Flexible process support — eutectic, epoxy, flip-chip and multi-layer dispensing — so one platform can serve multiple product lines.
• Turnkey integration expertise: vision-based placement, inline AOI, and handler/test systems that reduce cycle time and simplify traceability.
Explore our models and request a process evaluation to see how our Semiconductor Packaging Equipment can cut costs, increase yield, and scale with your roadmap. For inquiries and tailored solutions, contact Top-Leading Intelligent Technology!
EC400 Series Optical Chip Visual Inspection Machine
FEATURES:
Inspection Capa.: ≥0.5 μm;
Accuracy: ≥99.5%;
Inspection Throughput: 3–5 s/pcs;
Vertical large model for optical chips.
EC300 Series-Optical Module AOI Machine
FEATURES:
Inspection Capa.: ≤3 μm;
3D Repeatability: ±10 μm;
Inspection Throughput: 1200 UPH;
Vertical large model for optical modules.
EC200 Series IC Visual Inspection Machine
FEATURES:
2D+3D sub-micron full inspection capabilities, with 2D defect detection capability ≥10 μm and 3D inspection repeatability of ±10 μm, coupled with advanced RGB multi-light source combined imaging to capture every detail with unparalleled clarity.
Multi-functional Engineering Sorter-DMH-3000
FEATURES:
Comprehensive Backend Solutions: Integrating Automated Visual Inspection (AVI), Electrical Parametric Testing, and Thermal Stress Testing with high-speed IC Programming and Tape & Reel Packaging
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
