solutions
Advanced Packaging
KEY POINTS
OUR RECOMMENDATION
Die Bonding Machine FCB 9900FC
①Bonding precision: High rigidity, high response, lightweight gantry design, global precision achievable ±5μm@3σ;
②Heating station design: Optimal efficiency can reach 1500CPH, if not Grade 1 capability can reach 10000CPH;
③Flux application: Supports micrometer-level coating thickness control, flux template can achieve flatness within 5μm;
④Appropriate pressure control: Compatible with 50g-5000g pressure control range (optional 10g-1000g), pressure accuracy can achieve ±2g pressure control precision at low pressures;
FAQ
Flip chip bonding is a semiconductor packaging process where the chip is flipped and directly connected to the substrate using solder bumps, enabling higher performance and smaller form factors.
Die bonding typically attaches a chip to a substrate using adhesive, while flip chip bonding uses direct electrical interconnection through solder bumps, offering better electrical performance.
Our flip chip bonding machines achieve global accuracy up to ±5μm @3σ, suitable for high-end semiconductor applications.
Industries such as AI, 5G, automotive electronics, and high-performance computing rely heavily on advanced packaging technologies.
Yes, we offer tailored semiconductor packaging solutions based on your production requirements, including process customization and equipment configuration.
APPLICATION RESULTS
Our advanced packaging solutions are widely used across multiple industries:
· AI Chip Packaging
· 5G RF Modules
· Automotive Electronics
· High-Performance Computing (HPC)
· Consumer Electronics IC Assembly
These applications demand high precision, reliability, and scalability, all of which our bonding systems deliver.
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
