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    Advanced Packaging

    Flip chip technology connects chips to substrates by forming bumps directly on the chip surface. FCB (Flip Chip Bonding) is the core packaging process for high-density chips. Driven by 5G, AI, and advanced manufacturing processes, chip I/O density has surged dramatically, requiring extremely high interconnection precision and reliability.
    Advanced Packaging

    KEY POINTS

    Precision requirements achievable

    Bump alignment accuracy (<±5μm) requirements;

    Solder joint reliability risks

    Uneven pressure control easily leads to defects or solder ball collapse;

    High flux application requirements

    High flux application requirements, especially for precise flux placement and uniformity for each ball;

    Production efficiency requirements

    Need to achieve production efficiency above 1500CPH while maintaining high precision;

    OUR RECOMMENDATION

    Die Bonding Machine FCB 9900FC

    ①Bonding precision: High rigidity, high response, lightweight gantry design, global precision achievable ±5μm@3σ;

    ②Heating station design: Optimal efficiency can reach 1500CPH, if not Grade 1 capability can reach 10000CPH;

    ③Flux application: Supports micrometer-level coating thickness control, flux template can achieve flatness within 5μm;

    ④Appropriate pressure control: Compatible with 50g-5000g pressure control range (optional 10g-1000g), pressure accuracy can achieve ±2g pressure control precision at low pressures;



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    APPLICATION RESULTS

    APPLICATION RESULTS

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    Guangzhou Top-leading Intelligent Technology Co.,Ltd

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