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    Power Module

    The power module industry is currently facing a surge in demand for KGD (Known Good Die) testing due to yield fluctuations of third-generation semiconductor (SiC/GaN) chips, approximately 65%-85%. Manufacturers need dynamic aging tests (cycling from -55℃ to 175℃) and 3D X-ray inspections to ensure die reliability, with testing costs accounting for 15%-20% of the total module cost. The global market shows a "high-end shortage, mid-end competition" pattern, with KGD test pass rates for automotive-grade SiC modules below 60%, forcing test equipment suppliers to develop integrated solutions combining probe stations, thermal resistance analyzers, and THB test chambers. Chinese companies have achieved domestic substitution in photovoltaic module KGD testing, but automotive-grade testing still relies on probe technology from Japanese Advantest and German Cascade.
    Power Module

    KEY POINTS

    high-voltage and high-current testing (>1600V/100A), parallel reliability verification of multiple chips (failure rate <0.001%), and high-temperature condition simulation (-55℃ to 200℃).

    The current test yield for SiC automotive-grade modules is below 60%, forcing equipment upgrades.

    Solutions include nitrogen-sealed probes to prevent arcing, six-sided AOI detection of micro-cracks, and multi-station parallel architectures to improve efficiency, though probe lifetime at high temperature and domestic production rates remain pain points.

    The industry is accelerating the transition to specialized testing equipment for third-generation semiconductors, with testing costs accounting for 15%-20% of total module cost.

    OUR RECOMMENDATION

    KGD Test Sorting Machine

    1- High-voltage dynamic testing integration

    Develop a nitrogen-sealed probe system with voltage tolerance ≥2500V, integrating avalanche energy testing and dynamic parameter acquisition functions to address high-voltage and high-current (>1600V/100A) verification needs that traditional CP testing cannot cover.

    2-Multi-dimensional defect detection

    Use six-sided AOI (Automated Optical Inspection) with 10μm precision to simultaneously identify cutting micro-cracks, keeping the false rejection rate below 0.5%.

    3-Parallel testing architecture

    Design a flexible multi-test station configuration that supports differentiated temperature zones (e.g., room temperature/high temperature simultaneous testing) and parallel project execution to improve Units Per Hour (UPH).

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    APPLICATION RESULTS

    APPLICATION RESULTS

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    Guangzhou Top-leading Intelligent Technology Co.,Ltd

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