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    RF Microwave

    Packaging requirements are the primary concern, with packaging types mainly being ceramic packaging. The characteristics are many batches, low production volume, and high equipment stability requirements.
    RF Microwave

    KEY POINTS

    Multiple chips need to be die-bonded simultaneously on a ceramic tube shell or substrate, with up to 13 or more chip types handled at the same time.

    The chip sizes are small, making the picking and bonding of tiny chips difficult, which can lead to failure in picking or extra misalignment during bonding.

    For TR modules, microwave modules, and other products requiring high stability, gold-tin eutectic bonding is used, which requires high-temperature soldering.

    Some ceramic tube cavities are relatively deep, up to 10mm, making bonding more challenging.

    Compatibility with multiple feeding methods is required, including sub-ring and main-ring, wafer ring, feeder, waffle box, gel pack, etc.

    OUR RECOMMENDATION

    PNP6600A

    ①Can simultaneously mount up to 13 types of nozzles and 5 types of ejector pins, compatible with 35 Tray packs or gel packs;

    ②Precision micro force control (10g-200g±2g) and high precision (resolution <2μm);

    ③Compatible with products up to 15mm depth;

    ④Compatible with carrier rings, wafer rings, feeders, Tray packs, gel packs and other loading methods;

    ⑤Can achieve die bonding over a large 300 *200mm range;

    Can achieve eutectic processes at up to 450°C, with sealed track design providing good protective gas environment

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    APPLICATION RESULTS

    APPLICATION RESULTS

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    Guangzhou Top-leading Intelligent Technology Co.,Ltd

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