Automated Optical Inspection System — Accurate. Fast. Built for Production

Deliver defect-free electronics with an advanced Automated Optical Inspection (AOI) System designed for inline production and offline lab use. Our AOI platform combines precision optics, flexible multi-angle lighting, and AI-assisted image analysis to catch soldering faults, component misplacements, missing parts, and surface defects at high speed — reducing escapes, rework, and warranty risk for OEMs and contract manufacturers.

Top Leading develops semiconductor automated optical inspection (AOI) systems for packaging and optoelectronics production. Our EC series covers optical chips and chip-on-carrier (COC) assemblies, optical module COB processes, and IC die bond and wire bond inspection. Select 2D and 3D inspection functions, handling formats, and data connections around the actual part, defect criteria, and line requirements.

Choose an AOI System by Inspection Target

• ◆  Optical chips and COC assemblies: The EC400 optical chip AOI series addresses multi-side chip and chip-on-carrier inspection, including end-face, ridge, and electrode defects.

• ◆  Optical modules and COB assemblies: The EC300 optical module AOI series inspects bond wires, chips, pads, and related module components.

• ◆  IC packages, die bonds, and wire bonds: The EC200 IC inspection series checks die position, chip surfaces, bond wires, and solder balls during semiconductor packaging quality control.

EC400 vs EC300 vs EC200: Which AOI Platform Fits Your Process?

Why Choose Our Automatic Optical Inspection System

• ·  Enterprise-grade accuracy: Custom-engineered ±1µm precision motion stages ensure repeatable, high-resolution imaging for the smallest components and materials.

• ·  AI + traditional dual-mode detection: Hybrid algorithms combine deterministic rule-based checks with machine learning models to lower false calls while improving detection of new or complex defect types.

• ·  True 2D/3D inspection and multi-angle imaging: Capture top and side profiles, height/3D features, and perform instant overlay and 3D analysis for tombstoning, solder-volume, and coplanarity checks.

• ·  Flexible deployment: Modular hardware and software support inline conveyor integration, standalone bench units, or integration with upstream/downstream processes such as barcode marking, laser marking, and robotic loading.

• ·  Fast programming and traceability: DXF one-click programming and automated recipe generation shorten setup time, while full barcode/lot traceability and reporting simplify process control and customer audits.

Key Features: Engineered for Manufacturers

• ·  High-resolution optical heads with tunable RGB or structured lighting for contrast optimization.

• ·  Linear servo motor stages and vibration-damped marble platforms for micron-level stability.

• ·  AI-driven defect classification and automatic defect analysis for faster root-cause feedback.

• ·  Scalable throughput options: single-board inspection to high-speed inline systems for mass production.

• ·  Integration with dispensing and fluid-control systems for process verification and automation efficiency.

Benefits of Automated Optical Inspection Equipment

• ·  Reduce escapes and rework costs by identifying defects before assembly proceeds.

• ·  Shorten NPI cycles with rapid recipe creation and robust programming tools.

• ·  Improve yield and customer confidence with audit-ready traceability and actionable defect analytics.

What Defects Can Semiconductor AOI Detect?

Die and IC Package Defects

Depending on the inspection recipe, 2D imaging can identify a missing, shifted, or rotated die; chipping, scratches, and contamination; and deviations in visible die position or package features. EC200 is the primary listed system for IC die bond and wire bond inspection.

Bond Wire and Bond Pad Defects

Visible wire bond checks include missing or broken wires, wire sweep or sag, crossed wires, and bond ball position. For height-sensitive criteria such as wire loop height or coplanarity, define the 3D measurement range and acceptance limits during configuration.

Optical Chip and Module Defects

For optical chips, inspection can target end-face scratches, chipping, stains, ridge damage, and visible electrode or bond pad anomalies. For optical modules, the inspection plan can cover chip surfaces, bond wires, pads, end faces, and visible module features. The applicable views and defect sizes depend on the selected EC400 or EC300 configuration.

When Should You Specify 2D or 3D AOI?

2D AOI uses high-resolution images and controlled lighting to check visible appearance and position: missing or displaced die, broken wires, surface damage, stains, and marking errors. It is suitable when the pass/fail criterion can be defined from an image and a measured X-Y position.

3D AOI adds height or surface-profile information where a planar image cannot establish the required dimension. Typical semiconductor packaging checks include wire loop height, bond or lead coplanarity, and selected raised features. The available 3D checks depend on the sensor, field of view, surface material, and the specific recipe; request an inspection trial for your part.

Get a Quote

As a trusted AOI System Supplier, we provide complete inspection solutions tailored to your Semiconductor manufacturing line — from precision optics and intelligent software to seamless integration and after-sales support. Whether you’re looking for a reliable AOI System for Sale or a long-term technology partner to enhance your quality control process, we deliver systems that combine speed, accuracy, and scalability to keep your production ahead of the competition. Contact us today to discuss your inspection needs and request a personalized quote.