•Self-Developed Ultra-High-Resolution Optics + AI Deep Learning – 2D accuracy ±0.5 μm, 3D accuracy ±1 μm; captures defects as small as 0.005 mm², including 1 μm scratches and 0.5 μm stains.
•30+ dedicated inspection items – including end face scratches / chipping / stains, ridge damage / width anomalies, waveguide defects, metal layer bubbles, electrode / bond pad irregularities, and printing / size deviations.
•UPH up to 25K, with ≤0.4 sec per unit; AI one click changeover <15 min; supports MES/SECS/GEM communication, with automatic generation of defect map and traceability report.
•Compatible 0.3–15 mm Chip size with thickness of 0.1–3 mm, and suitable carriers of waffle packs / trays / tape & reel; supports standalone/inline operation and compatible with 8"/12" wafer level substrates.
•Optimized for optical chip end faces, ridges, and waveguides – suppresses specular reflection and transparent layer interference with a detection rate >99.95% and false detection rate <0.03%.
Applicable Industries:
High-speed Optical Communication (10G–1.6T); Silicon Photonics Manufacturing; Laser Chips; Advanced Packaging (SiP); Automotive Optoelectronics; Quantum Communication.
Supported Products:
DFB/EML/VCSEL; Silicon Photonics Chips; InP/GaN Optical Chips; Optical Engines; TOSA/ROSA; High-Speed Optical Modules.
Capabilities & Features
| Item | EC400 | EC400PRO |
| Detection Target | LD Chip, PD Chip, PIC Chip, TIA Chip, etc. | COC Component |
| Optical System | Chip Side Pixel Resolution: 0.06μm/Pixel
Chip Front Pixel Resolution: 0.17μm/Pixel
Chip Back Pixel Resolution: 0.35μm/Pixel | LD Side Pixel Resolution: 0.14μm/Pixel
LD Front Pixel Resolution: 0.68μm/Pixel
Substrate Front Pixel Resolution: 2.30μm/Pixel
Chip Back Pixel Resolution: 2.30μm/Pixel |
| Applicable Product Specifications | Optical Chip: 0.25-3mm (L) *0.25-0.5mm (W) *0.05-1mm (H) | COC: 0.5-3mm (L) *0.5-6mm (W) *0.2-3mm (H) |
| Loading Method | 6/8 Inch Wafer Load | Compatibility: 2 Inch Gel-Pak, 6 Inch Mother-Daughter Ring, Fishbone Fixture (Optional) |
| Unloading Method | 6/8 Inch Wafer Load | Compatibility: 2 Inch Gel-Pak, 6 Inch Mother-Daughter Ring, Fishbone Fixture (Optional OK/NG Sorting) |
| Detection Efficiency | 4s per unit (depending on product size and detection area) | 3s-5s per unit (depending on product size and detection area) |
| Equipment Dimensions | ≤1900*1500*1850mm (excluding three-color lamp and keyboard position) | ≤1900*1500*1850mm (excluding three-color lamp and keyboard position) |
| Extended Functions | Import Re-inspection System: Defect Analysis, Production Data Statistics, Manual Result Re-inspection
Product Traceability: Work Order Scanning Record Batch No., Carrier QR Code Recognition, Part No. ID Recognition
AI Training System: Fast Iteration of AI Model | Import Re-inspection System: Defect Analysis, Production Data Statistics, Manual Result Re-inspection
Product Traceability: Work Order Scanning Record Batch No., Carrier QR Code Recognition, Part No. ID Recognition
AI Training System: Internal Closed-loop Fast Iteration of A1 Model
Support Carbon Dioxide Cleaning Function
Loading Method: Quick Disassembly and Assembly of Different Fixtures
Support Back Detection |
FAQ:
Q: Can it detect 1μm micro-scratches on the optical chip end-face?
A: Absolutely. Using polarization optics + AI algorithms, it stably identifies scratches down to 1μm and contamination down to 0.5μm, with an accuracy >99.9%.
Q: Does it support high-volume inspection of wafer-level optical chips?
A: Absolutely. It is fully compatible with 8"/12" wafer substrates, featuring automatic loading/unloading + carrier transfer, quite suitable for mass production of Silicon Photonics (SiP) / Indium Phosphide (InP) devices.
