•Self-Developed Ultra-Depth-of-Field Fusion + Point Cloud Algorithm – solves inspection challenges of crossing wires, large-depth-of-field bonding wires, and defects on optical module end faces, housings, gold fingers.
•65MP Camera – 2D ±2 μm accuracy, 3D repeatability ±2 μm; min. detectable defect size of 0.01 mm²; supports arc height / coplanarity / warpage measurement.
•30+ Inspection Items, including bonding wires (missing wire, stray wire, crossing wire); optical modules (end face scratches / stains / chipping, gold finger coplanarity, housing deformation), and chips (scratches / damage / color difference).
•UPH up to 18K, with cycle time ≤0.6 sec per unit; AI guided programming, with changeover <20 min; Supports MES/SECS communication, automatically generating defect map and traceability report.
•Compatible Chip / Module Size: 0.5–30 mm, with supported carrier of trays / tape & reel / waffle pack; Capable of standalone and inline production.
Industry Applications:
Optical Communication (10G–1.6T), Advanced Semiconductor Packaging (SiP), AIoT, Automotive Optical Modules, Consumer Electronics.
Applicable Products:
Optical Modules (SFP/QSFP/OSFP), TOSA/ROSA, Optical Engines, Wire-bonded Chips, SiP Modules, WLCSP, RF & Sensor Modules.
| Item | EC300 | EC300 X |
| Inspection Targets | Solder balls, bonding wires, chips, pads, electronic components |
| Optical System | 2D defect detection capa. ≥ 5 μm (Option 3 μm.)3D inspection repeatability ±10 μmRGB multi-light source combined imaging | 2D defect detection capa. ≥ 10 μm3D inspection repeatability ±10 μmRGB multi-light source combined imaging |
| Compatible Product Specs.(mm*mm*mm) | Carrier Size: 100-300(L)*55-100(W)*4-10(H)Mag. Size: 110-210(L)*65-110(W)*120-170(H) | Carrier Size: 100-200mm(L)*55-100mm(W)*4-10mm(H)Mag. Size: 110-210mm(L)*60-110mm(W)*120mm-160mm(H) |
| Loading/Unloading Buffer Capa. | Loader Buffer: 310mm(L)*370mm(W)*160mm(H)Unloader Buffer: 310mm(L)*280mm(W)*160mm(H)Unloader NG Buffer: 310mm(L)*110mm(W)*150mm(H) | Loader Buffer: 201mm(L)*200mm(W)*160mm(H)Unloader Buffer: 201mm(L)*200mm(W)*160mm(H)No unloader NG buffer. |
| Equipment Dimension | 2400*1500*1700mm(Excluding tricolor light tower and keyboard area) | 1200*1400*1700mm(Excluding tricolor light tower and keyboard area) |
| Extended Functions | Built-in Review System: Defect analysis, production data statistics, manual result revie Product Traceability: Work order scanning with lot number recording, carrier QR code recognition, material ID recognition AI One-Click Programming: Intelligent programming, automatic template creation, automatic bonding wire drawing AI Intelligent Recognition: Automatic bonding wire extraction, automatic defect recognition, eliminating complex parameter tuning |
FAQ:
Q: How to solve slow NPI programming (2+ hours) that hurts line uptime?
A: Adopt the AI Routing Function. By leveraging AI automatically identifying gold wires, bond pads and dies to realize “AI-powered programming”, cutting programming time by 50%–90%. As demonstrated in comparison data, the total programming time for Model B dropped sharply from 139 minutes to 38 minutes, delivering a dramatic efficiency boost.
Q: For inspection objects with a large vertical span (such as gold wires or stepped chips), how can we avoid the problem of missed detection that occurs with traditional inspection?
A: Ultra-depth-of-field technology enables full-focus imaging to clearly capture features at different heights at the same time, providing “no-blind-spot” raw data for subsequent AI recognition, effectively avoiding misjudgment or missed detection caused by blurry visuals.
Q: Do we need two separate processes to inspect 2D surface scratches as well as 3D features such as gold wire height and component offset?
A: Our equipment supports simultaneous 2D+3D image acquisition. That is, the 2D vision identifies surface defects (such as dirt, stains, color differences), while 3D point clouds accurately capture 3D profile anomalies like height, flatness, and tilt. This combined solution achieves ensures inspection with no blind spots.
