•High-definition vision + AI algorithm; 2D accuracy: ±2 μm; 3D accuracy: ±5 μm; min. defect detecting capa.: 0.02 mm².
•Cover 60+ inspection points on chip surfaces, sides and leads and detect 20+ defect types including scratches, chipping, colour deviation, printing errors, lead deformation, coplanarity defects, etc.
•UPH up to 30K, allowing an efficiency of ≤0.5 seconds per single part. Miss rate is <0.05%, and false positive rate <0.1%.
•Guided programming – changeover time <30 minutes; supports MES/SECS communication; automatically generates defect maps and reports.
•Chip size range from 0.5 mm to 20 mm, with carrier compatible with trays or tape and reel, allowing stand alone use or inline integration.
Applications
Semiconductor P&T, consumer electronics, automotive electronics, optical communications, AIoT.
Compatible Products:
QFN, SOP, BGA, LQFP, SIP, WLCSP; memory chips, logic chips, power devices, RF chips, etc.
Capabilities & Features
| Item | EC200 |
| Inspection Targets | Solder balls, bonding wires, chips |
| Optical System | 2D Defect Detection Capa. ≥ 10 μm3D Inspection Repeatability ±10 μmRGB multi-light source combined imaging |
| Compatible Product Specs. | Compatible Carrier Size: 50~300mm (L) × 50~100mm (W) × 0.1mm~10mm (H) Compatible Mag. Size: 60~310mm (L) × 60~110mm (W) × 110mm~170mm (H) |
| Feeding/Unloading Buffer Capa. | Loader Buffer: 310mm (L) × 370mm (W) × 160mm (H)Unloader Buffer: 310mm (L) × 280mm (W) × 160mm (H)Unloader NG Buffer: 310mm (L) × 110mm (W) × 150mm (H) |
| Equipment Dimension | 2400*1500*1700mm (Excluding tricolor light tower and keyboard) |
| Extended Functions | Review System Import: Defect analysis, production data statistics, manual result review Product Traceability: Work order scanning with lot number recording, carrier QR code recognition, material ID recognition AI One-Click Programming: Intelligent programming, auto. template creation, automatic wire bonding drawing AI intelligent recognition: Auto. wire extraction, auto. defect recognition, eliminating complex parameter tuning
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FAQ:
Q: Programming during New Product Introduction (NPI) often takes 2 hours, severely impacting production line uptime. What can be done?
A: Enable the AI routing function. By using AI to automatically recognize gold wires, solder joints and dies, to accomplish “AI programming”, programming time can be reduced by 50%–90%. According to parameter comparison table, total programming time for Model B drops sharply from 139 minutes to just 38 minutes, delivering a significant efficiency improvement.
Question: For inspection objects with a large vertical span (such as gold wires or stepped chips), how can we avoid the problem of missed detection that occurs with traditional inspection?
Answer: Ultra-depth-of-field technology enables full-focus imaging to clearly capture features at different heights at the same time, providing “no-blind-spot” raw data for subsequent AI recognition, effectively avoiding misjudgment or missed detection caused by blurry visuals.
Q: Do we need two separate processes to inspect 2D surface scratches as well as 3D features such as gold wire height and component offset?
A: Our equipment supports simultaneous 2D+3D image acquisition. That is, the 2D vision identifies surface defects (such as dirt, stains, color differences), while 3D point clouds accurately capture 3D profile anomalies like height, flatness, and tilt. This combined solution achieves ensures inspection with no blind spots.
