•High-definition vision + AI algorithm; 2D accuracy: ±2 μm; 3D accuracy: ±5 μm; min. defect detecting capa.: 0.02 mm².
•Cover 60+ inspection points on chip surfaces, sides and leads and detect 20+ defect types including scratches, chipping, colour deviation, printing errors, lead deformation, coplanarity defects, etc.
•UPH up to 30K, allowing an efficiency of ≤0.5 seconds per single part. Miss rate is <0.05%, and false positive rate <0.1%.
•Guided programming – changeover time <30 minutes; supports MES/SECS communication; automatically generates defect maps and reports.
•Chip size range from 0.5 mm to 20 mm, with carrier compatible with trays or tape and reel, allowing stand alone use or inline integration.
Applications
Semiconductor P&T, consumer electronics, automotive electronics, optical communications, AIoT.
Compatible Products:
QFN, SOP, BGA, LQFP, SIP, WLCSP; memory chips, logic chips, power devices, RF chips, etc.
Capabilities & Features
| Item | EC200 Specifications |
| Inspection Target | Solder Ball, Bond Wire, Die |
| Optical System | • 2D defect inspection capability ≥ 10μm
• 3D inspection repeatability ±10μm
• RGB multi-light source combined imaging |
| Applicable Product Specifications | • Substrate size compatibility: 50~300mm (L) * 50~100mm (W) * 0.1mm~10mm (H)
• Magazine size compatibility: 60~310mm (L) * 60~110mm (W) * 110mm~170mm (H) |
| Loading & Unloading Magazine Capacity | • Loading buffer space: 310mm (L) * 370mm (W) * 160mm (H)
• Unloading buffer space: 310mm (L) * 280mm (W) * 160mm (H)
• NG magazine slot space: 310mm (L) * 110mm (W) * 150mm (H) |
| Equipment Dimensions | 2400 * 1500 * 1700mm (Excluding tower light and keyboard tray) |
| Extended Functions | • Review Station Integration: Defect analysis, production data statistics, manual result review
• Product Traceability: Work order scanning for batch logging, carrier QR code identification, part number ID recognition
• AI One-Click Programming: Smart programming, auto template generation, auto bond wire layout drafting
• AI Intelligent Recognition: Auto wire loop extraction, auto defect recognition, eliminating complex parameter tuning |
| Category Group 1 | Category Group 2 | Category Group 3 | Category Group 4 |
| Ball Size Deviation | Ball Lift | Ball Offset | Ball Bridging |
| Re-bonding | Broken Wire | Wire Sweep | Wire Sag |
| Missing Wire | Die Shift | Die Contamination | Missing Die |
| Die Scratch | Die Chipping | Die Rotation | Die Metrology |
FAQ:
Q: Programming during New Product Introduction (NPI) often takes 2 hours, severely impacting production line uptime. What can be done?
A: Enable the AI routing function. By using AI to automatically recognize gold wires, solder joints and dies, to accomplish “AI programming”, programming time can be reduced by 50%–90%. According to parameter comparison table, total programming time for Model B drops sharply from 139 minutes to just 38 minutes, delivering a significant efficiency improvement.
Question: For inspection objects with a large vertical span (such as gold wires or stepped chips), how can we avoid the problem of missed detection that occurs with traditional inspection?
Answer: Ultra-depth-of-field technology enables full-focus imaging to clearly capture features at different heights at the same time, providing “no-blind-spot” raw data for subsequent AI recognition, effectively avoiding misjudgment or missed detection caused by blurry visuals.
Q: Do we need two separate processes to inspect 2D surface scratches as well as 3D features such as gold wire height and component offset?
A: Our equipment supports simultaneous 2D+3D image acquisition. That is, the 2D vision identifies surface defects (such as dirt, stains, color differences), while 3D point clouds accurately capture 3D profile anomalies like height, flatness, and tilt. This combined solution achieves ensures inspection with no blind spots.
