Die Bonder
Advantage:
PRODUCT DESCRIPTION
Features
High Precision
±5μm @3σ placement accuracy
±0.07°@3σ rotational accuracy
MAX 1.7μm vision accuracy
Bonding range: 325*203mm
High Efficiency
Dual-gantry dual-bondhead high-speed die bonding
CPH: MAX 6000
Auto Calibration
Supports automatic accuracy calibration
Supports automatic thermal deformation compensation
Flux
Supports flux dipping production process
Specifications
X/Y Placement Accuracy: ±5μm@3σ (Calibration die)
Rotational Accuracy: ±0.07°@3σ (Calibration die)
Bondhead Rotation Angle: 0~360°
CPH ±10μm: 6000 (Standard die, no flux)
CPH ±5μm: 5000 (Standard die, no flux)
CPH ±10μm: 4500 (Standard die, with flux)
CPH ±5μm: 3900 (Standard die, with flux)
Supported Die Size: 0.5~50mm
Max Substrate Size: 325*203mm
Bond force (Optional): 10~1000gf, 50~5000gf
Optional automatic wafer feeding module
Supported Substrate Types: Strips, Boats, Panels
Supported Die Types: 8''/12'' Wafer ring, Waffle pack, Tray
Dimensions: 2330*1390*1630mm (including loader/unloader)
Operating Air Pressure: 0.4~0.6Mpa
Weight: 2000kg
Power Supply: 220V 50/60 Hz/2.5kVA
Operating Environment: 23±3℃ / 40%~60% RH
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
