For multi-process, high-precision, medium-to-high speed die bonding scenarios such as SiP, optical modules, RF/microwave components, and Mini/Micro LED, balancing stable accuracy with flexible process adaptability.
Advantage:
For multi-process, high-precision, medium-to-high speed die bonding scenarios such as SiP, optical modules, RF/microwave components, and Mini/Micro LED, balancing stable accuracy with flexible process adaptability.
PRODUCT DESCRIPTION
Features
•±5 μm @ 3σ, angular ±0.07° @ 3σ – precise and stable micro-module placement.
•Overhead gantry structure – larger stroke, more compact machine body, zero accuracy drift during long-term production, suitable for narrow production line layouts.
•Supports dual Uplook/Downlook modes – compatible with micro-chips, ultra-thin substrates, and high-density array alignment.
•Optional flux spraying, flip chip flux dipping, dispensing die bonding, and eutectic bonding – compatible with 320×320 mm wafer-level substrates.
•Max. UPH of 2000 (for a 1s process cycle) – supports micro-chips from 0.2 mm to 20 mm, with force control range from 0.5 N to 50 N, non destructive placement of ultra thin chips.
•Industries: Advanced packaging (SiP), optical communication modules, 5G RF/microwave components, Mini/Micro LED, sensors, automotive electronics.
•Products: Micro-modules, optical module TOSA/ROSA, RF chips, Mini LED chips, sensor chips, flip chip micro-chips, ultra-thin & multi-layer stacked modules.
| Item | PNP7000 LA |
| XY Bonding Accuracy (With Calibration Substrate) | ±10um@3σ |
| Rotary Accuracy (With Calibration Substrate) | ±0.2°@3σ |
| Bondhead Rotation Angle | 0-360° |
| CPH Efficiency Value | 5000 (With Standard Substrate) |
| Supported Chip Size (mm) | 0.2-50mm |
| Bondforce Range | 10~1000gf |
| Supported Substrate Type | Lead-frame, Strips, Carrier |
| Supported Chip Type | Wafer ring, Waffle pack, Wafer Expender Ring, Tray |
| Flip Chip Module | Option |
| Single/Dual Bond Head | Option |
| Automatic/Manual Tray Loading | Option |
| Working Pressure | 220V 50/60Hz |
| Equipment Weight (Kg) | 2300 |
| Power | 220V 50/60 Hz/2.5kVA |
| Working Environment | 23±3℃/40%~60% RH |
| Equipment Dimension (mm) | 2610*1500*2010（Including Loader and Unloader） |
For production teams working with compact devices and tight placement tolerances, the PNP7000 Micro-Module Die Bonder LA provides the control needed for stable, repeatable bonding results.
Looking for a high-precision die bonding solution for your micro-module production line?
Contact us to discuss your process requirements, application needs, and configuration options for the PNP7000 LA High-Precision Micro-Module Die Bonder.
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
