Advantage:
PRODUCT DESCRIPTION
Features
High Precision
±10μm @3σ placement accuracy
±0.2°@3σ rotational accuracy
Dual Dispensing Heads
Supports dual dispensing heads
High Speed
CPH: 5000 (Standard die)
Flip Chip
Supports flip chip production process
Full Automatic Loading
Supports automatic waffle box tray changing
Supports automatic wafer tray changing
Supports automatic 6~12in wafer ring changing
Supports automatic JEDEC Tray changing
Single/Dual Head Mode
Supports switching between single and dual head modes
Specifications
X/Y Placement Accuracy: ±10μm@3σ (Calibration die)
Rotational Accuracy: ±0.2°@3σ (Calibration die)
Bondhead Rotation Angle: 0~360°
CPH ±10μm: 5000 (Standard die)
Supported Die Size: 0.25~25mm
Max Substrate Size: 300*110mm
Bond Force: 10~1000gf
Optional flip-chip module
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
