With support for Uplook or Downlook vision positioning, dual dispensing heads, automatic tray and wafer handling, and single/dual head mode switching, the Micro-Module Die Bonder PNP7000 LA is built to improve both process flexibility and throughput. It is a practical solution for manufacturers looking for a high-performance die bonding platform for micro-module assembly, advanced packaging, and flip-chip-related applications.
Built for High-Precision Production
In micro-module manufacturing, even small deviations can affect bonding quality, yield, and long-term reliability. That is why the Micro-Module Die Bonder PNP7000 LA is engineered to combine stable motion control, accurate alignment, and automated material handling.
Whether the production line focuses on advanced packaging, compact device assembly, or high-value micro-components, this machine helps manufacturers maintain consistent quality while improving operational efficiency.
High Precision
±10μm @3σ placement accuracy
±0.2°@3σ rotational accuracy
Dual Dispensing Heads
Supports dual dispensing heads
High Speed
CPH: 5000 (Standard die)
Flip Chip
Supports flip chip production process
Full Automatic Loading
Supports automatic waffle box tray changing
Supports automatic wafer tray changing
Supports automatic 6~12in wafer ring changing
Supports automatic JEDEC Tray changing
Single/Dual Head Mode
Supports switching between single and dual head modes
Applications
The Micro-Module Die Bonder PNP7000 LA is suitable for a wide range of micro-assembly and semiconductor packaging applications, including:
· Micro-module assembly
· Optical module packaging
· Semiconductor advanced packaging
· MEMS and sensor assembly
· Flip-chip bonding processes
· RF and high-density electronic modules
· Precision chip attach applications
For production teams working with compact devices and tight placement tolerances, the PNP7000 Micro-Module Die Bonder LA provides the control needed for stable, repeatable bonding results.
Looking for a high-precision die bonding solution for your micro-module production line?
Contact us to discuss your process requirements, application needs, and configuration options for the PNP7000 LA High-Precision Micro-Module Die Bonder.
