Industry-unique dual-gantry architecture for superior placement throughput, max heating temperature up to 450°C, with sealed guideway protection for stable eutectic bonding performance.
PHS pulse heating stage, heating ramp rate ≥50°C/s & cooling ramp rate ≥30°C/s – Ideal for high-speed eutectic processes for optical communication and power devices.
Supports multi-nozzle & multi-ejector auto changeover – Compatible with diverse feeding chips and devices, enabling flexible single/multi-die eutectic without manual intervention.
Multiple eutectic modes available – Single-Die Eutectic, Multi-Die Individual Eutectic and Multi-Die Simultaneous Eutectic, to accommodate varied process requirements for optoelectronic packaging.
Packaged Products
Optical Communication Modules
High-speed eutectic bonding for LD, PD/TIA, VCSELs and optical sub-components. Stable temperature profile ensures consistent solder reflow and reliable optical coupling performance.
Power Semiconductor Devices
Perfect for power chip eutectic assembly. High ramp rate pulse heating and precise temperature control deliver low void rate bonding for high-power packaging.
LED Packaging
Suitable for high-power LED eutectic attach. Fast heating & cooling cycle improves production efficiency while maintaining bonding reliability.
Multi-Chip Optoelectronic Packages
Supports sequential or simultaneous eutectic of multiple dies in one recipe, streamlining complex multi-chip eutectic integration.
FAQ
Q: Can the pulse heating stage guarantee stable temperature repeatability during long-run production?
A: Featured with dedicated PHS pulse heating control algorithm and closed-loop temperature feedback, the system maintains consistent heating/cooling ramp and peak temperature for eutectic solder, delivering low-void and repeatable bonding results in continuous mass production.
Q: What eutectic modes does the PNP3200 LE support?
A: It supports Single-Die Eutectic, Multi-Die Individual Eutectic and Multi-Die Simultaneous Eutectic modes, which can be switched according to your product layout and process requirements.
Q: What is the typical cycle time for eutectic bonding?
A: The overall cycle time ranges from 6 ~ 8s (typical 7s), depending on chip size, travel distance and selected eutectic mode.
Applicable Industries
| Item | PNP3200LE pro | PNP3200LE max |
|---|
| Application Fields | Single Eutectic Bonding for COC / COS | PD Multi-Die Simultaneous Eutectic Bonding |
| X/Y Placement Accuracy (Calibration Die) | ±1.5μm | ±1.5μm |
| X/Y Placement Accuracy (Die) | ±3μm | ±3μm |
| Die Sorting Accuracy | / | ±2μm |
| CPH | Overall CT: 6 ~ 8s | Overall CT: 15 ~ 17s |
| Compatible Die Size | 0.15 - 3mm | 0.15 - 3mm |
| Bondforce Range | 10 ~ 1000g | 10 ~ 1000g |
| Auto Loading / Unloading | Option | Option |
| Auto Nozzle Change | Option | / |
| Auto Ejector Change | Option | / |
| Equipment Weight | 2300kg | 2300kg |
| Power Supply | 220V 50/60Hz | 220V 50/60Hz |
| Operating Environment | 23 ±3°C/ 40% ~ 60% RH | 23 ±3°C/ 40% ~ 60% RH |
