PNP6600 Series-Multi-Functional & High-Precision Die Bonder

• ±3μm @3σ chip bonding accuracy & ±0.05° @3σ rotary accuracy – Ideal for automotive and aerospace high-reliability packaging.

• 14 Nozzles & 5 Ejector Pins with Auto. Changeover – Compatible with chips/dies ranging from 0.15mm to 50mm in size and handle it without manual intervention.

• Up to 5 dispensing heads with auto changeover – Compatible with different adhesive materials of epoxy and silver paste, meeting your need for rapid changeover across various packaging scenarios.

• Multi-layer dispensing Capability – Accommodate complex process flows and supports multi-stage and differentiated dispensing/bonding solutions.

Applicable Industries

RF and Microwave Modules

Precise placement of MMICs, RF dies and multiple passive or active components. The system supports different die sizes, dispensing materials and placement positions within one assembly recipe.

Advanced Packaging and SiP

Suitable for multi-chip modules, hybrid packages and SiP assemblies requiring several die types, different adhesives and repeated tool changeover.

Optical Communication Modules

Supports the placement of VCSELs, photodiodes, laser dies, submounts and optical components where positional and angular accuracy directly affect optical coupling performance.

Power and Automotive Electronics

Applicable to power semiconductor modules, DC/AC modules, sensors and other high-reliability electronic assemblies requiring consistent adhesive application and repeatable die placement.

MEMS, Sensors and Imaging Devices

Suitable for MEMS devices, CIS, infrared chips and other sensitive components requiring controlled handling force and precise visual alignment.

Packaged Products

DC/AC Modules, CIS, Infrared Chips, PD/VCSEL Chips, Submounts, Lenses, etc.

Capabilities

FAQ 

Q: Does continuous production cause precision drift?
A: Featured with an integrated cast-frame in ultra-high rigidity, and combined with high-precision glass optical scale and ultra-precise 2D planar compensation technology, the equipment is capable of maintaining an accuracy within ±3μm in 300×200mm bonding area.
Q: For multi-chip bonding modules that requires both dispensing and dipping, how does your system handle it?
A: Our dispensing module uses an integrated design with both a dipping head and a dispensing head on the same platform. Both heads are mounted on X/Y/Z dispensing axis and controlled by the motion control system, allowing the dispensing and dipping performance on one machine, meeting multi-chip bonding needs while improving efficiency and process stability at the same time.
Q: What bonding materials are supported?
A: Epoxy resin, conductive silver paste, eutectic solder (with optional reflow/eutectic kit), and standard adhesives – compatible with both dispensing and dipping distribution modes.