Advantage:
Unique overhead gantry design, makes it possible for larger travel, smaller footprint and stable precision.
±3μm high-accuracy die bonding to meet your requirements for high precision and multi-function.
Designed for advanced semiconductor packaging and high-reliability electronics manufacturing, the PNP6600 Series automatic die bonder delivers high-precision die placement, flexible process integration, and stable production performance in one compact platform.
PRODUCT DESCRIPTION
Features
• ±3μm @3σ chip bonding accuracy & ±0.05° @3σ rotary accuracy – Ideal for automotive and aerospace high-reliability packaging.
• 14 Nozzles & 5 Ejector Pins with Auto. Changeover – Compatible with chips/dies ranging from 0.15mm to 50mm in size and handle it without manual intervention.
• Up to 5 dispensing heads with auto changeover – Compatible with different adhesive materials of epoxy and silver paste, meeting your need for rapid changeover across various packaging scenarios.
• Multi-layer dispensing Capability – Accommodate complex process flows and supports multi-stage and differentiated dispensing/bonding solutions.
Item PNP6600EVO PNP6600advanced Product Positioning RF, Microwave, Multi-chip placement Advanced packaging, SiP, Optical module COB packaging XY Placement Accuracy (calibration die) ±5μm@3σ (calibration die)
±7μm@3σ (die)±3μm@3σ (calibration die)
±5μm@3σ (die)Rotation Accuracy (calibration die) ±0.1°@3σ (calibration die), ±0.2°@3σ (die) Efficiency (calibration die) ±5μm CT: 3.6~5s
±7μm CT: 1.5~3s±3μm CT: 6.4~8.8s
±5μm CT: 4.8~6.4s
±7μm CT: 4.5~6sSupported Die Size 0.15-50mm Supported Placement Area 300*200mm Bondforce Range Optional: 10g-1000g, 50g-5000g Flip-chip Optional Flux Dipping Optional Bond Head UV Optional Substrate Auto Loading/Unloading Optional Nozzle Auto Change Optional Ejector Pin Auto Change Optional Supported Substrate Types Lead-frame, Carrier, Boat Lead-frame, Carrier, Boat Machine Weight 2200kg Machine Dimensions 2720*1450*1700mm
Precise placement of MMICs, RF dies and multiple passive or active components. The system supports different die sizes, dispensing materials and placement positions within one assembly recipe.
Suitable for multi-chip modules, hybrid packages and SiP assemblies requiring several die types, different adhesives and repeated tool changeover.
Supports the placement of VCSELs, photodiodes, laser dies, submounts and optical components where positional and angular accuracy directly affect optical coupling performance.
Applicable to power semiconductor modules, DC/AC modules, sensors and other high-reliability electronic assemblies requiring consistent adhesive application and repeatable die placement.
Suitable for MEMS devices, CIS, infrared chips and other sensitive components requiring controlled handling force and precise visual alignment.
DC/AC Modules, CIS, Infrared Chips, PD/VCSEL Chips, Submounts, Lenses, etc.
| 性能项目 | PNP6600EVO | PNP6600advanced |
|---|---|---|
| 产品定位 | 射频、微波、多芯片贴装等领域 | 先进封装、SIP、光模块COB封装等领域 |
| XY贴装精度（标定片） | ±5μm@3σ（贴标定片）、±7μm@3σ（贴芯片） | ±3μm@3σ（贴标定片）、±5μm@3σ（贴芯片） |
| 旋转精度（标定片） | ±0.1°@3σ（贴标定片）、±0.2°@3σ（贴芯片） | |
| 效率（标定片） | ·±5μm CT: 3.6~5s ·±7μm CT: 1.5~3s | ·±3μm CT: 6.4~8.8s ·±5μm CT: 4.8~6.4s ·±7μm CT: 4.5~6s |
| 支持芯片尺寸 | 0.15-50mm | |
| 支持贴合范围 | 300*200mm | |
| Bondforce范围 | 可选0.1N-10N、0.5N-50N | |
| 倒装 | 可选配 | |
| 助焊剂蘸盘 | 可选配 | |
| 邦头点胶 | 可选配 | |
| 独立点胶 / 蘸胶 / 喷胶 | 可选配 | |
| 基板自动上下料 | 可选配 | |
| 芯片上料 | 可选Ring环*1 / 子母环*1 / 2寸华夫盒*30 | |
| 7/14吸嘴自动更换 | 可选配 | |
| 顶针自动更换 | 可选配 | |
| 支持基板类型 | Carrier、Boat、Substrate | |
| 邦头UV | 可选配 | |
| 设备重量 | 2200kg | |
| 设备尺寸 | 2720*1450*1700mm | |
Q: Does continuous production cause precision drift?
A: Featured with an integrated cast-frame in ultra-high rigidity, and combined with high-precision glass optical scale and ultra-precise 2D planar compensation technology, the equipment is capable of maintaining an accuracy within ±3μm in 300×200mm bonding area.
Q: For multi-chip bonding modules that requires both dispensing and dipping, how does your system handle it?
A: Our dispensing module uses an integrated design with both a dipping head and a dispensing head on the same platform. Both heads are mounted on X/Y/Z dispensing axis and controlled by the motion control system, allowing the dispensing and dipping performance on one machine, meeting multi-chip bonding needs while improving efficiency and process stability at the same time.
Q: What bonding materials are supported?
A: Epoxy resin, conductive silver paste, eutectic solder (with optional reflow/eutectic kit), and standard adhesives – compatible with both dispensing and dipping distribution modes.
Specifications
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Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
