Eutectic Die Bonder PNP6600A

• ·  Adaptable Eutectic Bonding System with Multi-Stage Temperature Control

• Pre-heating, heating, and cooling stages with programmable thermal profiles for repeatable eutectic die bonding.

• ·  Eutectic Process Inert/Vacuum Anti-Oxidation Solution

• Fluxless or inert gas workflows to preserve metallurgical quality and prevent oxidation.

• ·  Optimized Bond Head & Multi-Die Support

• Supports larger and different-sized dies with precision; features up to seven nozzles and five ejector pins for high efficiency and flexibility.

• ·  Full Automation

• Automatic loading, production line integration, recipe storage, process logs, and optional MES connectivity for traceability.

• ·  Force Control & Scrub Function

• Air-bearing structure eliminates friction to improve force accuracy and stability (patented).

• Active scrub during wetting expels trapped gases and reduces voids.

• ·  High-Precision Vision Alignment

• Micron-level placement accuracy for demanding flip-chip bonding applications.

• ·  Modular Throughput Scaling

• Single-head to multi-head configurations to match pilot runs or high-volume production needs.

Packaged Products

Monolithic Integrated Circuits, RF Chips, Sensor Chips, Power Chips, etc.

The PNP6600A excels as a Flip Chip Bonder and Flip-Chip Eutectic Bonder by delivering consistent Eutectic Die Bonding results across R&D, pilot and production lines. As an Automatic Eutectic Bonder, it balances throughput and process control to meet modern flip chip bonder requirements for low voids and high joint integrity.

By integrating precise alignment, stable thermal control, and flexible process compatibility, modern Die Bonder systems support eutectic, flip-chip, and automated bonding requirements within a single platform. This combination enables manufacturers to scale production efficiently while meeting the stringent accuracy and reliability demands of next-generation semiconductor devices.