The PNP7000M Series is a fully automatic 3D Stacked Die Bonder developed for high-volume memory chip and multi-die package assembly. Combining vibration-suppressed high-speed motion, controlled ultra-thin die handling, flexible ejection methods and particle removal, the platform is designed to maintain stable placement as die thickness decreases and the number of stacked layers increases.
The PNP7000M supports face-up die bonding, while the PNP7000M Pro adds standard face-down and flip-chip bonding capability, a heated bond head and a wider bond-force range. Customers can select the configuration according to package structure, die orientation, adhesive process and target throughput.
Explore our complete range of automatic die bonders or learn more about our memory chip packaging solutions.
•Precision placement for high-speed stacked die bonding in memory chips, compatible with DAF multi-layer stacking and dispensing die attach processes, covering scenarios such as Flash, LPDDR, controller, and DDR chips.
•High-speed motion axis + vibration suppression technology contributes to a UPH up to 2,200 PCS/H (1s/chip), sustaining 2,200 PCS/H for face-up bonding and 1,800 PCS/H for flip-chip bonding.
•Featuring XY placement accuracy of ±5μm @3σ and angular accuracy of ±0.07° @3σ, it supports damage-free production of 25μm ultra-thin chips and challenging chip-stacking of 8 layers or more.
•Supports one-key switching between face-up and flip-chip bonding, compatible with PVRMS and PVMS processes, equipped with dual dispensing heads, and allows fast switching between direct and parallel dispensing modes.
•Supports automatic tray changeover for waffle pack and wafer ring, with versatile ejection options including single-ejector, multi-ejector, three-step, and four-step ejection.
•Heating capabilities of the bond head and stage can be up to 250°C±3°C.
•Supports chips from 0.5mm to 25 mm and substrate of 300 × 110 mm in differential types, such as ceramic, lead frames, and PCBs.
The PNP-7000M Stacked Die Bonder is engineered for modern memory and stacked-die production: high throughput, repeatable ±7 µm placement, and process-friendly handling for ultra-thin dies. It’s built to integrate into automated assembly lines and scale with your capacity roadmap.
As memory stacking and MCP/Lite-MCP packages push tolerances and production speed, PNP-7000M bridges precision and throughput — enabling manufacturers to increase yield and lower cost-per-die with features normally found on premium lines. The machine balances fast cycle performance with soft-handling for thinned die, flexible dispense control, and single/dual-head modes to match throughput or process complexity.
Applications
Memory Chip Manufacturing: Packaging for Flash, LPDDR, DDR, and Master Chip
Advanced Semiconductor Packaging Production: DAF multi-layer stacked chips, covering face-up bonding, flip-chip die bonding, ultra-thin and large size chip applications.
| Application | Typical Process Requirements | PNP7000M Series Capability |
|---|
| Flash and NAND memory packages | Multiple thin dies, DAF bonding and particle control | 25 μm die handling, multi-step ejection and particle removal |
| LPDDR packages | Compact package size and repeatable layer alignment | ±5 μm @3σ machine accuracy and angular control |
| MCP and Lite-MCP | Memory and controller dies within one package | Supports different die sizes and multi-layer stacking |
| DDR packaging | Face-up or BOC/face-down assembly depending on package design | PNP7000M Pro supports heated-head and flip-chip configurations |
| Controller die attachment | Mixed die dimensions and adhesive processes | Supports dies from wafer rings or waffle packs |
| Advanced stacked-die packaging | High layer count and cumulative offset control | Vibration-suppressed placement for eight or more layers |
Capabilities & Features
| Performance Parameter | PNP7000M | PNP7000Mpro |
|---|
| Product Positioning | Flash, LPDDR, Main Controller | Flash, LPDDR, Main Controller, DDR |
| XY Placement Accuracy | ±5μm@3σ (Calibration Die)±8μm@3σ (DAF Chip) | ±5μm@3σ (Calibration Die)±8μm@3σ (DAF Chip) |
| Angular Placement Accuracy | ±0.07°@3σ (Calibration Die)±0.1°@3σ (DAF Chip) | ±0.07°@3σ (Calibration Die)±0.1°@3σ (DAF Chip) |
| Bond Head Rotation Angle | 0~360° | ±170° |
| Throughput (UPH) | 2000(1s)PCS/H | Face-up: 2000(1s)PCS/HFace-down: 1600(1s)PCS/H |
| Bond Head Heating | N/A | MAX 250°C±3°C |
| Platform Heating | MAX 250°C, Temp Control Accuracy: 150°C±3°C | MAX 250°C, Temp Control Accuracy: 150°C±3°C |
| Supported Chip Size | 0.5~25mm | Face-up: 0.5~25mmFace-down: 0.5~15mm |
| Supported Substrate Size | 300*110mm | 300*110mm |
| Bond Head Force Control Range | 0.5N–50N | 1N–70N |
| Dispensing | Optional | Optional |
| Flip Chip Function | N/A | Standard Configuration |
| Waffle Pack Chip Feeding | Optional | Optional |
| Supported Substrate Types | Ceramic, Lead-frame, Substrates | Ceramic, Lead-frame, Substrates |
| Supported Chip Carrier | Wafer Ring, Waffle Pack | Wafer Ring, Waffle Pack |
| Supported Eject Mode | Single Pin, Multi-pin, 3-step Ejection, 4-step Ejection | Single Pin, Multi-pin, 3-step Ejection, 4-step Ejection |
| Equipment Overall Dimension | 2350mm×1400mm×1640mm | 2450mm×1400mm×1640mm |
| Equipment Weight | 2300kg | 2300kg |
How the PNP7000M Improves Multi-Layer Die Stacking Stability
Controlled Handling of 25 μm Ultra-Thin Dies
Ultra-thin memory dies can bend, crack or shift during wafer-tape separation, pickup and placement. The PNP7000M stacked chip die bonder combines configurable multi-step ejection, controlled bond force and stable motion control to reduce mechanical stress during handling.
Single-pin, multi-pin, three-step and four-step ejection modes allow the pickup process to be matched to die dimensions, die thickness, tape adhesion and DAF properties. This makes the platform suitable for both small dies and large, thin memory dies.
Vibration Suppression for Repeatable Placement
High-speed movement can introduce residual vibration at the bond head and affect the next placement cycle. In a multi-layer package, even a small offset at each layer can accumulate and reduce the available wire-bonding area.
The PNP7000M stacked chip die bonder uses high-speed motion axes with vibration-suppression technology to stabilize the bond head before placement. This helps maintain repeatable XY and angular accuracy during continuous production, including demanding eight-layer or higher stacking applications.
Particle Removal Before the Next Die Is Placed
Particles trapped between stacked dies can create local stress points, increase bond-line variation and contribute to cracking of thin dies. The PNP7000M stacked chip die bonder integrates particle-removal capability into the stacking process to improve interlayer cleanliness before the next die is placed.
This function is particularly important for thin DAF-based memory packages, where even small particles may affect die flatness and stack reliability.
Flexible DAF and Dispensing Processes
The machine supports DAF multi-layer stacked die bonding as well as optional dispensing-based die attach. Dual dispensing heads and selectable dispensing modes allow the process to be configured around adhesive type, deposit pattern, package layout and production speed.
The PNP7000M Pro stacked chip die bonder can switch between face-up and face-down bonding, making it suitable for production lines that process different memory package structures on the same equipment platform.
PNP7000M or PNP7000M Pro: Which Model Should You Select?
Choose the PNP7000M die stacking bonder when the production process mainly involves face-up DAF stacking or dispensing die attach for Flash, LPDDR and controller dies. It provides a 0.5–50 N bond-force range and supports dies up to 25 mm.
Choose the PNP7000M Pro die stacking bonder when the package requires face-down or flip-chip bonding, bond-head heating, DDR/BOC process compatibility or a wider force range. The Pro model provides standard flip-chip capability and bond-head heating up to 250°C.
Final machine configuration should be determined through actual-material evaluation because die size, thickness, DAF characteristics, wafer tape, substrate warpage and stack structure can affect both placement accuracy and production throughput.
FAQ
Q: Does the automatic die bonder support BOC packaging process for DDR3 and DDR4 production?
A: Absolutely. Equipped with the modules for face-up/flip-chip bonding and bond head heating, our equipment not only allows BOC packaging process for DDR3/DDR4 chips, but also support face-up bonding process.
Q: What are the efficiency advantages compared to competitors?
A: Competitors typically max out at around 2,000 PCS/H with an accuracy of ±10 μm. Our solution redefines the benchmark with 2,200 PCS/H and ±5 μm @ 3σ, delivering a definitive edge in both efficiency and accuracy.
Q: How to mitigate the impact of equipment vibration under continuous high-speed running?
A: Baseline vibration can hit ±50 μm without mitigation; while with our vibration suppression technology, the vibration amplitude is effectively controlled to ±5 μm, achieving a 90% reduction. This technology has already been field-proven and deployed in mass production on PNP7000 series equipment.
