•Precision placement for high-speed stacked die bonding in memory chips, compatible with DAF multi-layer stacking and dispensing die attach processes, covering scenarios such as Flash, LPDDR, controller, and DDR chips.
•High-speed motion axis + vibration suppression technology contributes to a UPH up to 2,200 PCS/H (1s/chip), sustaining 2,200 PCS/H for face-up bonding and 1,800 PCS/H for flip-chip bonding.
•Featuring XY placement accuracy of ±5μm @3σ and angular accuracy of ±0.07° @3σ, it supports damage-free production of 25μm ultra-thin chips and challenging chip-stacking of 8 layers or more.
•Supports one key switching between face up and flip chip bonding, compatible with PVRMS and PVMS processes, equipped with dual dispensing heads, and allows fast switching between direct and parallel dispensing modes.
•Supports automatic tray changeover for waffle pack and wafer ring, with versatile ejection options including single-ejector, multi-ejector, three-step, and four-step ejection.
•Heating capabilities of the bond head and stage can be up to 250°C±3°C.
•Supports chips from 0.5mm to 25 mm and substrate of 300 × 110 mm in differential types, such as ceramic, lead frames, and PCBs.
The PNP-7000M Stacked Die Bonder is engineered for modern memory and stacked-die production: high throughput, repeatable ±7 µm placement, and process-friendly handling for ultra-thin dies. It’s built to integrate into automated assembly lines and scale with your capacity roadmap.
As memory stacking and MCP/Lite-MCP packages push tolerances and production speed, PNP-7000M bridges precision and throughput — enabling manufacturers to increase yield and lower cost-per-die with features normally found on premium lines. The machine balances fast cycle performance with soft-handling for thinned die, flexible dispense control, and single/dual-head modes to match throughput or process complexity.
Applications
Memory Chip Manufacturing: Packaging for Flash, LPDDR, DDR, and Master Chip
Advanced Semiconductor Packaging Production: DAF multi layer stacked chips, covering face up bonding, flip chip die bonding, ultra thin and large size chip applications.
Capabilities & Features
| Item | 7000M | 7000Mpro |
| Product Capability | Flash/ LPDDR/ Main Controller | Flash/ LPDDR/ Main controller/ DDR |
| XY Bonding Accuracy | ±5μm@3σ | ±5μm@3σ |
| Angular Placement Accuracy | ±0.07°@3σ | ±0.07°@3σ |
| Bond Head Rotation Angle | 0~360° | ±200° |
| UPH Efficiency Value (1s) | 2200 PCS/H | Face-up:2200 PCS/HFace-down:1800 PCS/H |
| Bond Head Heating | / | MAX250°C + 3°C |
| Stage Heating | MAX250°C + 3°C | MAX250°C + 3°C |
| Supported Chip Size (mm) | 0.5~25 | Face-up: 0.5~25Face-down: 0.5~15 |
| Supported Substrate Size (mm) | 300*110 | 300*110 |
| Bond Force Range | 0.5N-50N | 1N-70N |
| Epoxy Dispensing | Optional | Optional |
| Flip Chip | / | Standard |
| Waffle Pack Loading | Ceramic, Lead-Frame, Substrates |
| Supported Substrate Types | Wafer Ring, Waffle Pack |
| Supported Ejection Method | Single Ejector, Multiple Ejector, Three-Step Ejection, Four-Step Ejection |
| Equipment Dimensions (mm) | 2350*1400*1640 | 2450*1400*1640 |
| Equipment Weight (Kg) | 2300 |
FAQ
Q: Does the equipment support BOC packaging process for DDR3 and DDR4 production?
A: Absolutely. Equipped with the modules for face-up/flip-chip bonding and bond head heating, our equipment not only allows BOC packaging process for DDR3/DDR4 chips, but also support face-up bonding process.
Q: What are the efficiency advantages compared to competitors?
A: Competitors typically max out at around 2,000 PCS/H with an accuracy of ±10 μm. Our solution redefines the benchmark with 2,200 PCS/H and ±5 μm @ 3σ, delivering a definitive edge in both efficiency and accuracy.
Q: How to mitigate the impact of equipment vibration under continuous high-speed running?
A: Baseline vibration can hit ±50 μm without mitigation; while with our vibration suppression technology, the vibration amplitude is effectively controlled to ±5 μm, achieving a 90% reduction. This technology has already been field-proven and deployed in mass production on PNP7000 series equipment.
