Unique overhead gantry design, makes it possible for larger travel, smaller footprint and stable precision.
±3μm high-accuracy die bonding to meet your requirements for high precision and multi-function.
Advantage:
Unique overhead gantry design, makes it possible for larger travel, smaller footprint and stable precision.
±3μm high-accuracy die bonding to meet your requirements for high precision and multi-function.
PRODUCT DESCRIPTION
Features
• ±3μm @3σ chip bonding accuracy & ±0.05° @3σ rotary accuracy – Ideal for automotive and aerospace high-reliability packaging.
• 14 Nozzles & 5 Ejector Pins with Auto. Changeover – Compatible with chips/dies ranging from 0.15mm to 50mm in size and handle it without manual intervention.
• Up to 5 dispensing heads with auto changeover – Compatible with different adhesive materials of epoxy and silver paste, meeting your need for rapid changeover across various packaging scenarios.
• Multi-layer dispensing Capability – Accommodate complex process flows and supports multi-stage and differentiated dispensing/bonding solutions.
Automotive Electronics, Medical Devices, Aerospace, Consumer Electronics, etc.
Flip-Chip Integrated Circuit Assembly & Advanced Semiconductor Packaging
Optical Modules – VCSEL, Photodiodes, Camera Sensors
Power Semiconductor Modules & RF Components
MEMS, Sensor Devices & Hybrid Electro-Optical Packaging
Automotive, Industrial, Medical & Communication Electronics
DC/AC Modules, CIS, Infrared Chips, PD/VCSEL Chips, Submounts, Lenses, etc.
| Item | PNP6600EVO | PNP6600advanced | PNP660OW |
| Product positioning | RF, microwave, multi-chip placement, and related fields | Optical modules, high-precision multi-chip placement, and related fields | Wafer-level placement, wafer-level sorting, and related fields |
| XY placement accuracy (calibration wafer | ±5μm@3σ | ±3μm@3σ | ±5μm@3σ |
| Rotation accuracy (calibration wafer) | ±0.1°@3σ | ±0.07°@3σ | ±0.05°@3σ |
| Efficiency (standard wafer) | CPH+10um:2500 CPH+5um:1000 | +10um CT:4.55~65 +5um CT:4.85~6.4s +3um CT:6.45~8.85 | CPH+10um:1150 CPH+5um: 950 |
| Supported chip size | 0.15-50mm | 0.15-50mm | 0.15-80mm |
| Supported bonding range | 300*200mm | 300*200mm | 330*330mm |
| Bondforce range | Optional 0.1N-10N, 0.5N-50N | Optional 0.1N-10N, 0.5N-50N | Optional 0.1N-10N, 0.5N-50N |
| Supported substrate types: | Lead-frame, Carrier, Boat, Substrate | Wafer ring, wafer, Lead-frame, Carrier, Boat, Substrate | Wafer ring, wafer, Lead-frame, Carrier, Boat, Substrate |
| Equipment weight | 2200kg | 2500kg | 2300kg |
| Equipment dimensions | 2720*1450*1700mm | 2720*1450*1700mm | 2720*1650*1700mm |
| Flip-chip | Optional | Optional | Standard |
| Flux dipping tray | Optional | Optional | Standard |
| Independent dispensing / glue dipping / spray dispensing | Optional | Optional optional | Optional |
| Bond head dispensing | Optional | Optional | / |
| Bond head UV | Optional | Optional | / |
| Automatic loading/unloading | Optional | Optional | Optional |
| Automatic changeover for 7/14 nozzles | Optional | Optional | Optional |
| Automatic ejector pin changeover | Optional | 2500kg | Optional |
Q: Does continuous production cause precision drift?
A: Featured with an integrated cast-frame in ultra-high rigidity, and combined with high-precision glass optical scale and ultra-precise 2D planar compensation technology, the equipment is capable of maintaining an accuracy within ±3μm in 300×200mm bonding area.
Q: For multi-chip bonding modules that requires both dispensing and dipping, how does your system handle it?
A: Our dispensing module uses an integrated design with both a dipping head and a dispensing head on the same platform. Both heads are mounted on X/Y/Z dispensing axis and controlled by the motion control system, allowing the dispensing and dipping performance on one machine, meeting multi-chip bonding needs while improving efficiency and process stability at the same time.
Q: What bonding materials are supported?
A: Epoxy resin, conductive silver paste, eutectic solder (with optional reflow/eutectic kit), and standard adhesives – compatible with both dispensing and dipping distribution modes.
Specifications
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Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
