Multi-Function Die Bonder PNP6600EVO — Flexible Die Attach & Flip-Chip Support
Supports multiple die bonding processes, enabling one machine for diverse customer production needs
The PNP 6600 EVO Multi-functional Die Bonder is a high-performance die bonding system engineered for both advanced R&D and low-to-medium volume production. Designed to support standard die bonding and flip-chip bonding within a single platform, it delivers an optimal balance of precision, flexibility, and throughput for modern semiconductor and optoelectronic packaging.
With modular hardware architecture, multi-nozzle automation, and stable force control, PNP 6600 EVO enables manufacturers to handle diverse die sizes, materials, and bonding processes while maintaining high yield and consistent quality.
The PNP 6600 EVO can be seamlessly integrated into standalone or semi-automated production lines. Comprehensive support is available, including installation, process optimization, operator training, and long-term spare parts service to ensure rapid ramp-up and stable production.
