Engineered for 250~450°C Eutectic Bonding
Eutectic Die Bonder
Advantage:
Engineered for 250~450°C Eutectic Bonding
PRODUCT DESCRIPTION
Features
1. Adaptable Eutectic Bonding System with Multi-Stage Temperature Control .(pre-heating/heating/cooling)
2. Eutectic process inert gas anti-oxidation solution
3. Optimized bond head enable larger die support while maximizing production capacity
4. Bond different-sized dies with precision using standard and flip-chip bonding solutions, featuring up to seven nozzles and five ejector pins for unmatched efficiency and flexibility.
5. Full automation: support automatic loading and production line
6. Improve force control accuracy and stability: Air-bearing structure in the center eliminates friction, awarded an invention patent
Packaged Products
Monolithic Integrated Circuits, RF Chips, Sensor Chips, Power Chips, etc.
Specifications
Bonding Process: Standard / Flip-chip
Cleanroom Class: 1000
Accuracy: ±7μm @ 3σ
CPH: Max 2500 (Process time 50ms )
Dimensions: 1300L × 1420W × 1700H mm
Net Weight: 1500kg
Shipping Dimensions: 1500 × 1620 × 1900mm
Max Bonding Size: 300 × 150mm
Max Magazine Size: 310 × 210 × 190mm
Voltage: AC 220V ±10%
Frequency: 50Hz
Power Consumption: 300L/min
Compressed Air: 0.4Mpa–0.7Mpa
Operating Temperature: 23±3℃
Operating Humidity: 30%–80% RH
Noise Level: <75 dB at 1 meter with machine doors closed
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
