PNP7000M serves as a high-speed stacked die bonder, primarily used to stack and bond memory chips.
Eutectic Die Bonder
Advantage:
PNP7000M serves as a high-speed stacked die bonder, primarily used to stack and bond memory chips.
PRODUCT DESCRIPTION
Features
1.High precision
2.Flip chip
3.Dual dispensing heads
4.Automated loading
5.Ultra-Thin die handing
6.Single/Dual-head mode
Specifications
X/Y bonding accuracy +7um@3σ（Calibration）
Support Substrate Types:Lead-frame,Strips Carrier
Rotation accuracy +0.07'@3σ (calibration sheet)
Supported Chip Type：Wafer ring ,Waffle pack
Bond head rotation angle: 0~360°
CPH:2400 (1s)
Dimension:2610*1500*2010mm(loading&unloading)
Support Chips Size:0.25~25mm
Operating Air Pressure:0.4~0.6Mpa
maximum substrate size:300*110mm
Weight:2300kg
Bond force:50~5000gf
Power supply:220V 50/60Hz/2.5kVA
Optional flip-chip module
Operating environment:20±3℃/40%~60%RH
Optional single/double dispensing head
Optional automatic/manual tray loading
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
