Supports multiple die bonding processes, enabling one machine for diverse customer production needs
Eutectic Die Bonder
Advantage:
Supports multiple die bonding processes, enabling one machine for diverse customer production needs
PRODUCT DESCRIPTION
Features
1. Compatible with dot dispensing and dip glue methods using pneumatic, piezoelectric, or screw valve configurations
2. Supports up to five dip glue heads with automatic switching (epoxy resin, silver paste)
3. Automatically switches between fourteen nozzles and five ejector pins to handle various chip/die sizes; supports both standard and flip-chip bonding for enhanced flexibility
4. Multi-layer dispensing capability for complex workflows
5. Enhanced force control accuracy and stability: Central air-bearing structure eliminates friction; awarded an invention patent
Applicable Industries
Automotive Electronics, Medical Devices, Aerospace, Consumer Electronics, etc.
Packaged Products
DC/AC Modules, Camera Chips, Infrared Chips, PD/VCSEL Chips, Holder Brackets, Lenses, etc
Specifications
Bonding Process: wire bonding/ Flip-chip Die Bonding
Cleanroom Class: 1000
Accuracy: ±5μm @ 3σ
CPH: Max 2500 (Process time 50ms)
Dimensions (mm): 1650L × 1420W × 1700H
Net Weight: 1800kg
Shipping Dimensions: 1850 × 1620 × 1900mm
Max Bonding Size (mm): 300 × 200
Max Magazine Size (mm): 310 × 210 × 190
Voltage: AC 220V ±10%
Frequency: 50Hz
Power Consumption: 300L/min (likely air usage)
Compressed Air: 0.4Mpa – 0.7Mpa
Operating Temperature: 23 ± 3℃
Operating Humidity: Relative Humidity 30% – 80% RH
Noise Level: <75 dB measured 1 meter away with door closed
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
