High-temperature adaptation, precise screening, efficient mass production, and cost control.
Advantage:
High-temperature adaptation, precise screening, efficient mass production, and cost control.
PRODUCT DESCRIPTION
Features
Reliability Test
UIS supports up to 3KV; SC supports up to 3000A.
High Efficiency
Innovative Handler and Tester architecture for higher efficiency; comprehensive UPH up to 4K based on customer requirements and test content.
High Precision
Low stray inductance and low contact resistance ensure reliable signal purity. Test circuit stray inductance <50nH, die contact resistance <10mΩ.
Static Test
Supports 3KV/600A voltage and current.
Dynamic Test
Supports 2KV/1500A voltage and current.
High Stability
Testing environment is protected by high-temperature/ambient nitrogen to form an inert atmosphere preventing arcing. High-temperature environment up to 175°C±2°C.
Specifications
Compatible Products: SiC/IGBT bare die
Input Formats: 6/8" Wafer; Tape & Reel, and Custom Tray
Die Size: 2mm2mm~8mm8mm
Die Thickness: 80μm~600μm
Cycle Time: <700ms (including test)
Main Test Items: Dynamic/Static/UIS/SC, etc.
Test Environment: High temperature/Ambient
Temperature Range: Ambient to 200℃
Temperature Stability: ±2℃, Resolution 0.1°C
Product Protection: Nitrogen / Dry Air (Deoxygenated)
Placement Accuracy: ±30μm@3σ
Placement Angle: ±0.5°@3σ
Front/Back Vision Inspection: Accuracy >10μm, detectable with contrast >30; Defects: scratches, dirt, foreign objects, explosion points, missing corners, edge chipping, etc.
Side Vision Inspection: Accuracy >20μm, detectable with contrast >30; Defects: edge chipping, pits, corner chipping
Operational Stability: MTBF >168h; MTBA >2h
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd