Test Handler
Advantage:
Dedicated test and sorting equipment for Die-level KGD (Known Good Die) and targeting third-generation semiconductors, power devices, memory chips and advanced packaging, it performs electrical testing, visual inspection and precision sorting prior to packaging. Only qualified dies proceed to packaging, making it a core piece of equipment for quality improvement and cost reduction of automotive-grade and industrial-grade chips.
PRODUCT DESCRIPTION
Features
•Electrical Testing Capabilities: Supports high voltage / high current / dynamic / avalanche / leakage current testing.
•Wide temperature range from room temperature to 200°C with a ±0.5°C temperature control accuracy, meeting automotive-grade aging and screening requirements for SiC/GaN power chips.
•Inspection Accuracy: 2D ±2μm / 3D ±5μm, covering edge chipping, scratches, contamination, warpage, and electrode defects – no micro level defects missed.
•Throughput & handling: Multi station parallel operation with a max. UPH of 4,000. Compatible with 8"/12" wafers, blue film, waffle packs, and tape & reel and fully automatic loading/unloading.
•Gentle & Precise Die Handling: Flexible adaptation for vacuum pickup / ejector pin to ensure non destructive handling of ultra thin or micro dies from 0.3mm to 20mm. ±10μm sorting accuracy, supporting multi bin grading management.
•Software & Data Integration: SECS/GEM & MES communication, with individual die data traceability + bad die mapping + automatic report generation, suitable for smart factory integration.
Third-generation semiconductors (SiC/GaN), power electronics, automotive electronics, optical communications, memory chips, advanced packaging (SiP/2.5D/3D).
Supported Products:
Power devices (MOSFET/IGBT), SiC/GaN bare dies, memory chips (Flash/LPDDR), optical chips, RF chips, automotive-grade logic chips.
| Item | KGD Testing & Sorting Handler |
| Compatible Products | SiC bare die |
| Feeding Format | wafer 6/8/12英寸、Tape&Ree and customized Tray |
| Chip Size | 2mm*2mm-8mm*8mm |
| Chip Thickness | 80um~600um |
| UPH | 4K |
| Main Test Items | Dynamic / Static / UIS / SC, etc. |
| Test Environment | High Temp / Room Temp |
| Temp Range | Room Temp~200℃ |
| Temp Stability | ±2℃, with Resolution of 0.1°C |
| Product Protection | Nitrogen (N₂) |
| Placement Accuracy | ±25um@3σ |
| Placement Angle | ±0.5°@3σ |
| Equipment Dimension | 3100mm（L）*1400mm（W）*1900mm（H） |
Q: Supports SiC/GaN high voltage & high temperature testing?
A: Rated for 3000V and 200°C, suitable for automotive-grade tests of third-gen semiconductors.
Q: What is the difference from conventional sorters?
A: Our SC900A performs full KGD testing on bare dies (including electrical test + visual inspection + high-temperature) to eliminate potential defects before packaging, while conventional sorters only conduct sorting after packaging.
Q: Supports high-volume wafer-level production?
A: Absolutely, it is compatible with 8"/12" wafers and quite suitable for mass production with fully automatic operation and 4000 UPH efficiency.
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
