Test Handler
Advantage:
This equipment integrates wafer-level inspection, high-precision sorting, automatic loading & unloading and data traceability into one platform, compatible with 6", 8", and 12" wafers,as well as chips ranging from 0.5×0.5 mm to 15×15 mm, and covering various components including SiC, IGBT, CIS and MEMS, enabling precise sorting, high-efficiency mass production and cost control for advanced packaging.
PRODUCT DESCRIPTION
Features
•Capacity: 8"/12" Wafers | 0.3–20mm Chips | ≥0.1mm Ultra-thin | Non-destructive sorting.
•Speed & Accuracy: Multi station parallel operation; 25K UPH | Vision ±5μm | Placement ±10μm | multi bin grading (up to 10 bins).
•Inspection: 2D ±2μm / 3D ±5μm | Scratches/Chipping/Contamination/Warpage/ electrode defects detection| <0.05% miss rate.
•Handling: Flexible Pick-and-Place /Ejector Pin Adaptation | Ultra thin / 0.3 ~ 20 mm Micro-Chips Non Destructive | Sorting Accuracy ±10 μm | •Multi-bin Sorting Management with Auto Wafer Expansion | Waffle/Tray/Tape Output | WaferMap Import | Changeover <20 min.
•Smart Factory Integration: SECS/GEM | MES | Full Traceability & Auto Reports.
Advanced packaging (SiP/2.5D/3D), third-generation semiconductors (SiC/GaN), memory chips, optical communications, automotive electronics, power devices.
Compatible Products:
Bare dies, memory chips (Flash/LPDDR), power devices (MOSFET/IGBT), optical chips (DFB/VCSEL), RF chips, automotive-grade logic chips.
| Item | SC600A | SC601A |
| Feeding Formats | 6/8/12寸wafer、Tray、Tape*Reel | |
| Chip Size | 0.5*0.5mm~15*15mm | |
| Chip Thickness | ≥80um | |
| UPH | 30K | 5K |
| Number of Output Bins | Single-BIN | Multi-BIN (Max. 6 BIN) |
| Unloading Method | 6/8/12-inch wafer/Tray/ Tape&Reel | Tray/ Tape&Reel |
| Force Range | 50g（0.5N）~1000g（10N） | |
| Force Accuracy | ≤±10% | |
| Placement Accuracy | ±25um@3σ | |
| Angular Accuracy | ±0.5°@3σ | |
| Double-Sided Inspection | Inspection Resolution: >10μm; Min. Contrast Sensitivity: >30;Detectable Defects: Scratches/ contamination/ foreign material/ micro-cracks/ chipping/ edge defects. | |
| Equipment Dimension | 1500mm（L）*1500mm（W）*1900mm（H） | 2400mm（L）*2300mm（W）*1900mm（H） |
Q: Support for ultra-thin / micro-chips?
A: Yes, compatible with 0.3 mm micro chips and 0.1 mm ultra-thin chips. With flexible suction & ejection system, it ensures a sorting yield above 99.9% with zero damage.
Q: What is the difference from a regular sorter?
A: Our Die Sorter performs fully automatic wafer level sorting (picking directly from blue film), offering higher efficiency and suitability for advanced packaging; while regular sorter typically handle post-packaging sorting.
Q: Compatible with KGD test line?
A: Absolutely. It supports in-line operation with SC900A KGD Test Handler, forming a seamless flow of electrical test → visual inspection → sorting, fully suitable for automotive-grade chip mass production.
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
