Test Handler
PRODUCT DESCRIPTION
Features
Closed-loop force control
Picking solutions for different thickness products
Non-mechanical correction
Specifications
Equipment Information
Applicable Components: Chips before and after packaging, SiC, IGBT
Applicable Size: 0.40.2mm to 10mm10mm
UPH: >20K
MTBA: ≥2h
MTBF: ≥168h
Number of Nozzles: 20/24/30
Input Method
Wafer Size: 6, 8, 12 inch
Die Thickness: >80μm
Picking Direction: Face-up / Face-down (choose one)
Output Method
Standard: Taping (up to 4 tapes)
Optional: JEDEC Tray, Waffle pack, Blue film, Bulk
Vision System
Vision Algorithm: AI deep learning, traditional algorithms
Inspection Items: Defect classification, character inspection, orientation, pre-sealing and post-sealing inspection (optional)
Inspection Items
Defect Classification Inspection
Marking Inspection
Orientation / Polarity Inspection
Pre-sealing Inspection
Post-sealing Inspection (Optional)
Electrical Test System
Test Stations: Supports 6 stations
Contact Method: Spring / Probe / Board-to-board; Kelvin / Non-Kelvin testing
Contact Position: Back electrode, Side electrode, Front electrode
Force Control System
Contact Pressure: 50g (0.5N) to 1000g (10N)
Accuracy: ≤±10%
Correction System
XY Position Accuracy: ±25μm
θ Angle Accuracy: ±0.5°
Software System
Communication Interface: TCP/IP, GPIB, RS-232, TTL, SECS GEM
Data System: Real-time monitoring, data saving, data export
Machine Specifications
Dimensions: 1600mm*1900mm*1900mm
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
