Test Handler
Advantage:
It delivers a maximum UPH of 30K, inspection capability ≥10μm and placement accuracy of ±25μm@3σ, compatible with wafer, tray and T&R incoming materials. Equipped with automatic loading, XYR alignment and DDR motor angular error compensation modules, it supports real-time full-lifecycle traceability of wafer maps and yield. With high-precision vision inspection and abundant communication interfaces, it enables efficient and precise sorting of bare dies.
PRODUCT DESCRIPTION
Features
•Fully Automatic Loading：It supports automatic switching of Waffle Pack, Wafer Tray and JEDEC Tray.
•XYR Transfer & Alignment Module：It achieves alignment repeatability ≤±5μm and avoids chip damage from mechanical clamping aligners.
•Precision Compensation for DDR Motor (Angular Errors)：It delivers positioning accuracy ≤±5 arcsec and repeatability ≤±1 arcsec after angular error compensation.
•Real-Time Traceability of Full-Cycle Wafer Map & Yield：It enables remote data monitoring and full-lifecycle traceability of production data with wafer map and yield tracking.
Automotive Power Semiconductors, Optoelectronics, Advanced Packaging, Sensors, Consumer Electronics & IoT.
| Item | Subitem | Technical Parameter |
|---|---|---|
| Inspection Target | Compatible Components | Bare Die |
| Compatible Size | 0.5mm × 0.5mm ~ 15mm × 15mm | |
| Die Thickness | > 80μm | |
| UPH | UP TO 15K | |
| Loading | Wafer | 6"/8"/12" Wafer Frame / Grip Ring (Expansion Ring) |
| Tape & Reel | Φ180mm / Φ330mm | |
| Tray | JEDEC Tray, Waffle Pack (2"/4") | |
| Unloading | Option | One of the Following: JEDEC Tray, Waffle Pack (2"/4"), 6"/8" Wafer Frame / Grip-Ring (Expansion Ring) |
| Vision System | Algorithm | AI Deep Learning Algorithm; Traditional Algorithm |
| Camera Configuration | 5 MP / 25 MP (Option) | |
| FOV | 17mm × 17mm | |
| Inspection Capability | Min. Detectable Defect Size > 25μm / 10μm | |
| Inspection Items | Defect Classification / OCR / Orientation / Pre-Seal Tape / Post-Seal Tape Inspection (Option) | |
| Force Control System | Accuracy | 50g (0.5N) ~ 1000g (10N) ≤ ±10g +5% |
| Alignment System | Placement Accuracy | ±25μm@3σ, ±0.5°@3σ |
| Software System | Communication Interface | TCP/IP, GPIB, RS-232, TTL, SECS GEM |
| Equipment Dimensions | Full-Enclosure | 1600mm × 1900mm × 1900mm |
Q: What is the maximum UPH of SC6000?
A: It reaches up to 30K UPH to meet high-volume wafer-level mass production demands.
Q: What is the placement accuracy and inspection capability?
A: It features placement accuracy of ±25μm@3σ and minimum detectable defect size down to 10μm.
Q: What incoming formats does SC6000 support?
A: It is compatible with Wafer, Tray and Tape & Reel (T&R) for flexible material loading.
Q: What advantages does the DDR motor angular error compensation bring?
A: It delivers positioning accuracy ≤±5 arcsec and repeatability ≤±1 arcsec for ultra-precise rotation control.
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Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
