Advantage:
Dedicated to visual defect inspection, electrical performance testing and final packaging for chip capacitors, including SLC, array capacitors, MLC and silicon capacitors, meeting the requirements for high precision, wide compatibility and intelligent operation in mass production of miniature semiconductor components, and thus serving as the key equipment to improve the outgoing quality and production efficiency of chip capacitors.
PRODUCT DESCRIPTION
Features
•One-stop Integration of Visual Inspection+ Electrical Testing +Precision Sorting – Replaces complex inline setups, improving efficiency by 50%.
•Turret + DD motor – UPH up to 40K, with ±0.01 mm full servo positioning and non destructive handling of micro components (force <1N).
•2/6/7-sided Full Inspection – 2D accuracy ±2 μm, min. defect 0.01 mm²; detects scratches, edge chipping, color deviation, and dimension errors.
•Complete LCR / Insulation / Withstand Voltage Testing – Patented fixtures, and ±0.5% test accuracy; compatible with SLC/MLC/multi electrode components.
•Product Changeover <15 minutes, with vibration bowl / 6″ blue film for loading and tape & reel / waffle pack / tray for unloading; MES/SECS traceability.
Semiconductor passive components, consumer electronics, 5G communications, automotive electronics, new energy.
Compatible Products:
SLC/MLC multilayer capacitors, array capacitors, resistor-capacitor networks, multi-electrode micro components.
| Item | Parameter |
| Model | SC3021 |
| Chip Size | 0.2mm*0.2mm~10mm*10mm |
| Feeding Format | Bulk/wafer |
| Unloading Format | Waffle Pack/Gel-pak/wafer |
| UPH | 5K |
| Main Test Items | Capacitance, Dissipation Factor, Insulation Resistance, Withstand Voltage |
| Waffle Pack Placement Accuracy | Single-side spacing ≥0.03mm,; Placement Yield >96%. |
| Blue Film Placement Accuracy | ±25um；±1° |
| Visual Inspection | Inspection accuracy: >5µm, with detectable contrast ratio >30 Defect types: scratches, abrasion, gold missing, excess gold, edge curling, peeling, pits, indentations, discoloration, contamination, chipping, electrode position offset, etc. |
| Equipment Dimension | 1500mm（L）*1300mm（W）*1900mm（H） |
Q: What is the minimum component size for testing?
A: It supports min.component size of 0.254mm×0.254mm×0.1mm, reaching the industry limit with non-destructive testing.
Q: What are the advantages compared to traditional single machines?
A: Three-in-one integrated design with 40K UPH (single machine 15K), 30% smaller footprint and yield up to 99.95%.
Q: Supports high voltage & high temperature?
A: Yes, it is rated for 1000V and 150°C, suitable for burn-in screening of automotive-grade components.
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
