Test Handler
Advantage:
It achieves a maximum UPH of 5K and supports simultaneous sorting of up to 6 BINs, with placement accuracy of ±25μm@3σ and force-control accuracy of ±10g~5%. Equipped with height and force self-calibration, full-process monitoring for thin dies and micron-level AOI inspection, it features fast miss-detection response and a low false alarm rate. Compatible with multiple input and output carriers, it is suitable for mass sorting production of bare dies.
PRODUCT DESCRIPTION
Features
•Multi-Bin Unloading：It supports up to 6-Bin simultaneous unloading with 6 independent tape & reels or 6 trays.
•Self-Calibration for Height & Force：It achieves height repeatability of ±1 μm and force control accuracy of 50g~1kg, ±10g~5%.
•Full-Process Monitoring for Thin Chips：It delivers miss detection response time below 10ms and a false alarm rate ≤0.01%.
•AOI Algorithm – High Detection Rate：It adopts robust detection strategy for high defect capture rate with micron-level defect detection capability.
Third-generation semiconductors, automotive electronics, power devices, optoelectronics and advanced semiconductor packaging.
| Item | Subitem | Technical Parameter |
|---|---|---|
| Inspection Target | Compatible Components | Bare Die |
| Compatible Size | 0.5mm × 0.5mm ~ 15mm × 15mm | |
| Die Thickness | > 80μm | |
| Loading | Wafer | 6"/8"/12" Wafer Frame / Grip Ring (Expansion Ring) |
| Tape & Reel | Φ180mm / Φ330mm | |
| Tray | JEDEC Tray, Waffle Pack (2"/4") | |
| Unloading | Option | JEDEC Tray / Waffle Pack (2"/4") / Reel (6 Independent Tape & Reels / 6 Trays) |
| Number of BINs | MAX. 6 BINs (6 Independent Tape & Reels / 6 Trays) | |
| Vision System | Algorithm | AI Deep Learning Algorithm; Traditional Algorithm |
| Camera Configuration | 5 MP / 25 MP (Option) | |
| FOV | 17mm × 17mm | |
| Inspection Capability | Min. Detectable Defect Size > 25μm / 10μm | |
| Inspection Items | Defect Classification / Character / Orientation / Pre-Seal Tape / Post-Seal Tape Inspection | |
| Force Control System | Accuracy | 50g (0.5N) ~ 1000g (10N) ≤ ±10g +5% |
| Alignment System | Placement Accuracy | ±25μm@3σ, ±0.5°@3σ |
| Software System | Communication Interface | TCP/IP, GPIB, RS-232, TTL, SECS GEM |
| Equipment Dimensions | Full-Enclosure | 2800mm × 2400mm × 1900mm |
Q: Does it support multi-bin sorting?
A: Yes, it supports simultaneous unloading of up to 6 BINs, with 6 independent tape & reels or 6 trays available.
Q: What is the placement and force control accuracy?
A: The placement accuracy is ±25μm@3σ, and the force-control accuracy reaches 50g~1kg, ±10g~5%.
Q: Can it realize stable inspection for ultra-thin chips?
A: Yes, it adopts full-process monitoring for thin chips, with miss detection response time＜10ms and false alarm rate ≤0.01%.
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
