It is dedicated to ultra-thin die sorting, supporting throughput up to 15K UPH and compatible with 12-inch wafers, with a placement accuracy of ±25μm@3σ. Adopting multiple types of ejector modules, low-stress pickup, infrared micro-crack inspection and zero bottom-side contact design, it effectively protects the DAF layer. Powered by AI vision algorithms, it can reliably handle ultra-thin bare dies as thin as 25μm and detect hidden cracks.
Ejector Module Compatibility：It supports Single Ejector, Multi Ejector, Three-Step Ejector (PVMS) and Four-Step Ejector (PVRMS).
Ultra-Thin Chip Handling：It adopts flexible-buffering nozzle, low-stress pickup and compliant-contact algorithm.
Infrared Micro-Crack Inspection： It enables real-time inspection of hidden cracks during sorting.
Zero Bottom-Side Contact： It achieves zero bottom-side contact during die handling to prevent damage to the DAF layer.
Third-generation semiconductors, automotive electronics, power devices, advanced semiconductor packaging.
| Item | Subitem | Technical Parameter |
|---|---|---|
| Inspection Target | Compatible Components | Bare Die |
| Compatible Size | 0.5mm × 0.5mm ~ 15mm × 15mm | |
| Die Thickness | 25μm ~ 600μm | |
| UPH | UP TO 15K | |
| Loading | Wafer Size | 6"/8"/12" Wafer Frame |
| Pickup Orientation | Non - Flip | |
| Unloading | Standard | 6"/8"/12" Wafer Frame |
| Option | JEDEC Tray; Waffle Pack (2"/4"); 6-Inch Grip-Ring / Expansion Ring | |
| Vision System | Algorithm | AI Deep Learning Algorithm; Traditional Algorithm |
| Camera Configuration | 25 MP | |
| FOV | 17mm × 17mm | |
| Inspection Capability | Min. Detectable Defect Size > 10μm | |
| Inspection Items | Top-Side / Bottom-Side / Side-Surface/ Infrared Inspection - (5 MP / 1.3 MP) | |
| Alignment System | XY Placement Accuracy | ±25μm@3σ |
| θ-Angle Accuracy | ±0.5°@3σ | |
| Software System | Communication Interface | TCP/IP, GPIB, RS-232, TTL, SECS GEM |
| Data System | Real-Time Data Monitoring & Statistics; Inspection Data Storage; Data Export |
Q: Can it handle ultra-thin bare dies?
A: It supports die thickness from 25μm to 600μm, with a maximum throughput of 15K UPH..
Q: What wafer sizes and unloading carriers are available?
A: It works with 6"/8"/12" wafer frames; optional unloading formats include JEDEC tray, waffle pack and 6-inch grip ring.
Q: What inspection functions does the vision system provide?
A: It supports top-side, bottom-side, side-surface and infrared inspection, capable of detecting micro hidden cracks above 10μm.
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Guangzhou Top-leading Intelligent Technology Co.,Ltd
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Guangzhou Top-leading Intelligent Technology Co.,Ltd
