Automated Wire Bonding & Chip Inspection AOI System
The EC300PRO is an AI-driven Automated Optical Inspection (AOI) system specifically designed for wire bonding and chip-level inspection in semiconductor backend manufacturing.
Its core value lies in replacing subjective manual inspection with high-precision, repeatable 2D/3D optical measurements, while maintaining production-line compatibility.
This system is well positioned for:
· IC packaging & assembly
· Wire bonding process control
· Final visual quality inspection before downstream testing or shipment
Core Technical Capabilities
AI-Based Defect Recognition
The system integrates AI algorithms to identify wire bonding and chip surface defects.
Compared to rule-based AOI, AI significantly improves:
· Detection consistency across shifts and operators
· Adaptability to product variation
· Reduction of false rejects caused by lighting or surface reflection changes
This aligns well with modern smart-factory and Industry 4.0 inspection requirements.
Advanced Optical System with Adjustable RGB Lighting
The EC300PRO adopts a self-developed optical system combined with adjustable RGB illumination, allowing flexible optimization for:
· Different bonding wire materials
· Varying chip surface reflectivity
· Diverse package types and substrates
This is critical in wire bonding inspection, where lighting stability directly affects defect recognition reliability.
2D + Real-Time 3D Inspection
Unlike basic 2D AOI, the EC300PRO supports multi-layer imaging and real-time 3D analysis, enabling quantitative inspection of:
· Wire loop height
· Bond ball height and volume
· Deformation, lifting, short circuits, and misalignment
The combination of 2D pattern recognition and 3D dimensional validation greatly reduces ambiguity in pass/fail decisions.
High Measurement Accuracy
According to the specifications:
These figures are suitable for fine-pitch wire bonding and high-density packaging applications, where micron-level deviation can directly affect yield and reliability.
Technical Highlights
· AI-powered AOI → consistent and automated inspection
The AI-driven system quantifies human experience to improve throughput while reducing false positives/negatives, which is critical for modern AOI.
· Proprietary optics + adjustable RGB lighting
Custom optics with adjustable RGB light allow optimization for different packages, wire types, and reflective surfaces, enhancing feature extraction for AI analysis.
· Multi-layer imaging + real-time 3D analysis
Supports multi-layer image fusion and fast 3D measurement (not just planar images), critical for assessing wire height, bumps, short circuits, and bond ball volume.
· High-precision metrics
· Production line compatibility
Supports various carriers (leadframe, steel/aluminium) and online/offline operation. Max inspection area 300×300mm. Compatible with barcode/laser marking for traceability.
Integration & Production-Line Compatibility
From a manufacturing integration standpoint, the EC300PRO offers several practical advantages:
· Compatible with lead frames, steel carriers, and aluminum carriers
· Supports online and offline operation modes
· Optional barcode reading, inkjet marking, and laser marking modules for traceability
· Maximum inspection area up to 300 × 300 mm, covering a wide range of IC and module formats
The system is clearly designed with MES integration and lot tracking in mind, reducing barriers to deployment in automated backend lines.
Key Advantages
1. Reduces human inspection variability, improves yield stability
AI algorithms reduce cross-shift/operator inconsistency.
2. Optical flexibility for multiple package types
Adjustable RGB and proprietary optics ensure clear feature capture across different materials and reflective surfaces.
3. 2D/3D combined inspection reduces false alarms
Quantitative 3D measurements support objective pass/fail decisions.
4. Production-line friendly, supports online/offline use
Seamless integration with upstream and downstream processes and traceability features for MES/lot control.
5. Compact footprint and standard facility requirements
Device dimensions and 220VAC/0.4–0.6MPa pneumatic requirements fit standard assembly lines.
Applicable Industries: Semiconductor, new energy and other industries
Testing Products: IC, SOP, BGA, QFP, SIP, Flip Chip, Memory, etc.
For semiconductor backend manufacturers seeking to reduce manual inspection dependency, improve yield consistency, and prepare for smart manufacturing, Our automated wire bonding system represents a competitive inspection platform.
