AI-powered AOI automates wire bond and chip inspection—boosting throughput while eliminating human error.
Automated Optical Inspection System
Advantage:
AI-powered AOI automates wire bond and chip inspection—boosting throughput while eliminating human error.
PRODUCT DESCRIPTION
Features
1. In-house developed optical system with tunable RGB lighting and dynamic motion-compatible inspection.
2. Customized platform for inline/offline production, featuring fail-safe feeding, adjustable track height, and modular barcode reading (manual/auto), with inkjet/laser marking
3. Boost inspection accuracy with AI-driven multi-layer imaging and instant 3D analysis
4. Offline/online re-inspection system
Applicable Industries: Semiconductor, new energy and other industries
Testing Products: IC, SOP, BGA, QFP, SIP, Flip Chip, Memory, etc.
Specifications
Equipment Dimensions: 2400×2000×2100mm (including loader/unloader)
Net Weight: 2000kg (including loader/unloader)
Facility Requirements:
· Input power: Single-phase 220VAC
· Input air source: 0.4-0.6MPa
Loading Method: Compatible with lead frame carriers, steel sheet carriers, aluminum alloy carriers, upstream/downstream track interfacing and other feeding methods
Inspection Range: Maximum compatible 300×300mm
Wire Bonding 2D Detection Accuracy: 10μm±3μm
Wire Bonding 3D Detection Accuracy: Up to ±10μm
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
Contact Us
Guangzhou Top-leading Intelligent Technology Co.,Ltd
