Automatic Wire Bonding Machine EC300PRO — Inline AOI & Wire Bonder
AI-powered AOI automates wire bond and chip inspection—boosting throughput while eliminating human error.
In-house developed optical system with tunable RGB lighting and dynamic motion-compatible inspection.
Customized platform for inline/offline production, featuring fail-safe feeding, adjustable track height, and modular barcode reading (manual/auto), with inkjet/laser marking
Boost inspection accuracy with AI-driven multi-layer imaging and instant 3D analysis
Offline/online re-inspection system