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    Memory Chips

    Memory chip packaging accounts for over 70% of global semiconductors,with stacking technology being mainstream for FLASH chip packaging. Under the rapid development driven by the current Al boom, packaging capacity and stacking layers continue to increase.Therefore, memory chip packaging manufacturers strive to balance cost and yield, with UPH (Units Per Hour)being a core competitive indicator.
    Memory Chips

    KEY POINTS

    Multi-chip stacking

    Due to increased memory chip stacking capacity, there is growing demand for 8+ layer chip stacking, requiring higher alignment accuracy and force control precision

    Efficiency bottleneck

    Single machine UPH needs to breakthrough above 2K

    Ultra-thin chip pick and place

    Due to increased stacking layers, to reduce overall package thickness,more and more chips under 50um thickness are used

    Foreign material control

    Particle contamination causes alignment defects during packaging,resulting in failures

    OUR RECOMMENDATION

    High-speed stacked chip die bonder PNP 7000M

    1.Bonding precision: Decoupled suspension XYZ bonding platform design, global precision achievable ±7μm@3σ

    2.Production efficiency: High-speed motion axis + high power consumption design, optimal efficiency can reach 7000CPH, with contact bonding time achieving effiency above 5000CPH

    3.High precision pressure control: Compatible with 50g-5000g pressure control range,pressure accuracy can achieve +2g precision at low pressures

    4.Self-developed multi-step reverse ejection system,capable of handling chips as thin as 25μm

    5.High-efficiency clean-level particle detection and isolation design, ensuring production yield

    6.Optional dispensing system (single or dual) and flip chip module for DDR6 packaging processes

    7.Optional TRAY automatic loading system to improve production efficiency

    Explore More

    APPLICATION RESULTS

    High-speed stacked chip die bonder PNP 7000M

    APPLICATION RESULTS

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