Comprehensive Backend Solutions: Integrating Automated Visual Inspection (AVI), Electrical Parametric Testing, and Thermal Stress Testing with high-speed IC Programming and Tape & Reel Packaging
Tri-Temperature Test Product
Our Tri-Temperature Test Handler delivers reliable, repeatable thermal testing across the full tri-temp spectrum so you can validate device performance where it matters most — from extreme cold to high heat. Designed for engineering labs and scalable to production lines, this handler combines precise thermal control, high throughput multi-site testing, and broad device compatibility to shorten time-to-market and reduce test costs.
| Model | Equipment Type | Temperature Range | DUT/Package Size | Batch or Throughput | Suitable Application |
|---|---|---|---|---|---|
| DMISM-1000T | Desktop tri-temperature handler | -55°C to +125°C | 3 × 3 mm and above | 100–50,000 units/batch | Engineering validation and small-to-medium production |
| BNx-3000 | Parallel burn-in testing system | RT to +150°C | Configure by DUT | 144–20,000 channels | Long-duration reliability and burn-in testing |
| Other Model | Production tri-temp handler | Confirm specification | Confirm specification | Confirm UPH | High-volume final test |
· Wide, industry-grade temperature range for true tri-temp testing (cold → ambient → hot), supporting the full range of device characterization and qualification needs.
· Active thermal control (ATC) and multi-zone temperature management keep DUT temperatures stable and uniform during high-power or long soak tests, improving data quality and yield.
· Multi-site parallel testing and optimized handling mechanics deliver high units-per-hour throughput while minimizing jams and socket wear — ideal for semiconductor production and high-volume validation.
· Flexible cooling/heating architectures (LN₂ or modern refrigerant thermal engines) let you match performance to cost and facility constraints.
· Engineered to support a wide array of package types (QFN, BGA, QFP, TO-packages, SOT23, etc.) and easy kit changeover for fast product mix-shifts.
· Full tri-temp capability with precision thermal control for accurate soak and transition cycles.
· Configurable parallelism (single-site up to multi-site arrays) so you can prioritize throughput or per-device characterization as required.
· Industry-proven sockets, thermal engines, and pre-heat designs that integrate seamlessly with ATE test heads and common production workflows.
· Industrial mechanical design with accessible maintenance points helps reduce unplanned downtime and simplify routine servicing.
Automotive Semiconductors
Tri-temperature functional and reliability testing for automotive MCUs, sensors, power devices and control ICs before production release.
Power Semiconductors
Controlled hot, ambient and cold testing for MOSFETs, IGBTs, power modules and other thermally demanding devices.
MEMS and Sensors
Temperature-dependent functional testing and calibration for pressure sensors, motion sensors and other MEMS devices.
Industrial and Networking ICs
Engineering validation and final testing for industrial controllers, communication devices, AI accelerators and networking components.
You get a handler built around three priorities: thermal accuracy, operational throughput, and integration flexibility. That means faster validation cycles in engineering labs, repeatable results for qualification, and a cost-effective path to production scale-up without re-architecting your test cell.
Multi-functional Engineering Sorter-DMH-3000
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Comprehensive Backend Solutions: Integrating Automated Visual Inspection (AVI), Electrical Parametric Testing, and Thermal Stress Testing with high-speed IC Programming and Tape & Reel Packaging
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