Tri-Temperature Test Handler — Precision Thermal Test

Our Tri-Temperature Test Handler delivers reliable, repeatable thermal testing across the full tri-temp spectrum so you can validate device performance where it matters most — from extreme cold to high heat. Designed for engineering labs and scalable to production lines, this handler combines precise thermal control, high throughput multi-site testing, and broad device compatibility to shorten time-to-market and reduce test costs.

Benefits of Tri-Temperature Handler

• ·  Wide, industry-grade temperature range for true tri-temp testing (cold → ambient → hot), supporting the full range of device characterization and qualification needs.

• ·  Active thermal control (ATC) and multi-zone temperature management keep DUT temperatures stable and uniform during high-power or long soak tests, improving data quality and yield.

• ·  Multi-site parallel testing and optimized handling mechanics deliver high units-per-hour throughput while minimizing jams and socket wear — ideal for semiconductor production and high-volume validation.

• ·  Flexible cooling/heating architectures (LN₂ or modern refrigerant thermal engines) let you match performance to cost and facility constraints.

• ·  Engineered to support a wide array of package types (QFN, BGA, QFP, TO-packages, SOT23, etc.) and easy kit changeover for fast product mix-shifts.

Technical Highlights

• ·  Full tri-temp capability with precision thermal control for accurate soak and transition cycles.

• ·  Configurable parallelism (single-site up to multi-site arrays) so you can prioritize throughput or per-device characterization as required.

• ·  Industry-proven sockets, thermal engines, and pre-heat designs that integrate seamlessly with ATE test heads and common production workflows.

• ·  Robust mechanical design for long MTBF and easy maintenance — reduces downtime and total cost of ownership.

Applications

Automotive-grade qualification, industrial and power-device validation, sensor and MEMS characterization, AI/HPC and networking device validation — anywhere component behavior must be proven across extreme operating temperatures.

Why Choose This Tri-Temp Test Solution

You get a handler built around three priorities: thermal accuracy, operational throughput, and integration flexibility. That means faster validation cycles in engineering labs, repeatable results for qualification, and a cost-effective path to production scale-up without re-architecting your test cell.