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    Optical Modules

    With the continuous improvement of AI computing power, optoelectronic chips as core components of optical communication face enormous market demands and technical challenges. The arrival of the high-computing era has driven the evolution and upgrade of optical communication technology, with high speed, high integration, and large capacity becoming core demands for optoelectronic packaging
    Optical Modules

    KEY POINTS

    Optical module packaging processes are numerous and differ from conventional semiconductor chip packaging, especially with significant technical barriers in the chip mounting field:

    Since optical chips need to align with connecting optical fibers during mounting, very high precision requirements are placed on equipment;

    Picking and placing micro chips is highly difficult, easily resulting in failure to pick up or adhesion deviation during placement;

    Diversified die bonding processes: For example, dispensing processes are often used simultaneously, and high-end output methods often require eutectic processes;

    Production efficiency issues: Current optical communication die bonding machines on the market have efficiency below 500UPH, improving efficiency is a pain point for major packaging manufacturers

    OUR RECOMMENDATION

    Die Bonding Machine PNP 6600L:

    ①Ultra-high precision die bonding platform design, local repeatability ≤±3μm@3σ;

    ②Precision micro chip picking (10g-200g@3σ) and high precision (±2μm@3σ);

    ③Compatible with dispensing/die bonding processes and eutectic processes;

    ④Multi-carrier loading method, capable of accommodating up to 6 five-inch carriers to meet multi-channel optical module packaging requirements;

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    APPLICATION RESULTS

    APPLICATION RESULTS

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    Guangzhou Top-leading Intelligent Technology Co.,Ltd

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