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    Optical Modules

    With the continuous improvement of AI computing power, optoelectronic chips as core components of optical communication face enormous market demands and technical challenges. The arrival of the high-computing era has driven the evolution and upgrade of optical communication technology, with high speed, high integration, and large capacity becoming core demands for optoelectronic packaging
    Optical Modules

    KEY POINTS

    Optical module packaging processes are numerous and differ from conventional semiconductor chip packaging, especially with significant technical barriers in the chip mounting field:

    Since optical chips need to align with connecting optical fibers during mounting, very high precision requirements are placed on equipment;

    Picking and placing micro chips is highly difficult, easily resulting in failure to pick up or adhesion deviation during placement;

    Diversified die bonding processes: For example, dispensing processes are often used simultaneously, and high-end output methods often require eutectic processes;

    Production efficiency issues: Current optical communication die bonding machines on the market have efficiency below 500UPH, improving efficiency is a pain point for major packaging manufacturers

    Process stability and yield control: Variations in bonding force, adhesive volume, temperature, or placement height can cause die tilt, adhesive overflow, inconsistent bond-line thickness, and reduced production yield;

    Flexible production and changeover: Different optical module designs involve varied die sizes, carriers, substrates, and bonding recipes, requiring equipment to support efficient tool and product changeover.

    OUR RECOMMENDATION

    Die Bonding Machine PNP 6600L:

    ①Ultra-high precision die bonding platform design, local repeatability ≤±3μm@3σ;

    ②Precision micro chip picking (10g-200g@3σ) and high precision (±2μm@3σ);

    ③Compatible with dispensing/die bonding processes and eutectic processes;

    ④Multi-carrier loading method, capable of accommodating up to 6 five-inch carriers to meet multi-channel optical module packaging requirements;

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    The EC400 Series is recommended for automated defect inspection of optical chips and CoC components before or after critical packaging processes.

    ① Automated multi-side inspection for LD, PD, PIC, TIA and CoC components;

    ② Non-contact handling helps reduce scratches, contamination and ESD-related damage;

    ③ Provides 2D inspection accuracy up to ±0.5 μm and 3D inspection accuracy up to ±1 μm;

    ④ Supports defect mapping, production statistics, product traceability and optional MES/SECS/GEM communication.

    Explore the EC400 Series


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    EC400 Series Optical Chip Visual Inspection Machine

    Recommended Equipment by Process Stage

    Process RequirementRecommended EquipmentPrimary Function
    Optical chip pickup and placementPNP6600 SeriesPrecision die handling and alignment
    Multi-chip module assemblyPNP6600 SeriesFlexible component and substrate handling
    Epoxy or silver paste applicationPNP6600 SeriesDispensing, dipping and multi-stage bonding
    Optical chip surface inspectionEC400 SeriesAutomated defect detection
    CoC component quality controlEC400 SeriesNon-contact multi-side inspection
    Production data and defect traceabilityEC400 SeriesDefect mapping and system communication


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    APPLICATION RESULTS

    APPLICATION RESULTS

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    Guangzhou Top-leading Intelligent Technology Co.,Ltd

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