In the semiconductor manufacturing process, IC packaging equipment plays a critical role in chip assembly, bonding, inspection, testing, and mechanical interconnection. The stability of these processes directly affects packaging quality, yield, and product reliability.
The molding system programmed by ASM IC packaging equipment can be flexibly used for single-roll or double-roll molding, which helps prevent damage to plasticized items and ensures better packaging quality.
Similarly, modern advanced packaging and testing equipment—such as those provided by Top Leading including Die Bonder systems, Automated Optical Inspection (AOI), Test Handlers, Tri-Temperature Test Products, and Press Fit Machines—are widely used in advanced packaging, memory chips, optical modules, power devices, RF/microwave applications, and reliability testing scenarios.
Then, what matters should be paid attention to when using IC packaging equipment?
1. Environmental Influence on Packaging Process
The preheating and stabilization time of IC packaging equipment is significantly affected by ambient temperature. When the environmental temperature is higher, the system reaches thermal balance faster.
However, operators should not start production immediately after the temperature display reaches the target setpoint. At this moment, the rubber rollers or key thermal components may not yet be fully stabilized, even though localized temperature near the sensor has reached the required level.
Generally, the warm-up stabilization time should be no less than 20 minutes.
The standard working environment for such equipment is:
· Temperature: 5–40°C
· Relative humidity: ≤80%
· No corrosive gases
Under normal seasonal and environmental conditions, the equipment can operate normally without affecting sealing or packaging quality.
2. Impact of Rubber Roller Hardness on Packaging Quality
The rubber roller hardness of sealing or molding equipment is typically around 50 Shore A.
If the rubber roller becomes hardened, aged, or cracked due to long-term use, the packaging quality will be significantly affected. In such cases, sealing may become weak, uneven, or incomplete.
Therefore, the rubber roller must be inspected regularly and replaced in time to ensure stable process performance and consistent packaging quality.
3. Packaging Quality Inspection
The final packaged product should meet the following standards:
· Transparent and flat appearance
· Firm and uniform sealing between sleeve and core
· No interlayer defects or voids
· No blurred printing or white haze
· No oil stains, particles, or impurities
Common defect analysis includes:
· Partial unsealing → usually caused by insufficient sealing temperature
· Deformation or wrinkling → caused by excessive temperature or pressure
· Air bubbles or white haze → caused by improper molding temperature
· Adhesive overflow → caused by excessive temperature or pressure
Proper parameter control is essential to ensure stable and high-quality packaging results.
Conclusion
The above are key considerations when using ASM IC packaging equipment or similar advanced semiconductor packaging systems.
At Top Leading, we are equipped with a team of senior engineers and a professional after-sales service team. With strong technical capability and rich project management experience, we provide advanced and well-structured humanized process design solutions to help customers improve manufacturing processes and product quality.
