PNP7000M supports both single-head and dual-head production and performs fully automatic placement.

With a high-speed motion axis and vibration suppression design, the machine can reach up to 6000 UPH. For bonding processes that take 1 second,it can achieve an efficiency of over 2400 UPH.

Achieves high-precision stacking and bonding of ±7um globally and stack up to 32 layers of chips, meeting your needs for high-precision and high-speed thin die stacking and bonding.

Adaptable Eutectic Bonding System with Multi-Stage Temperature Control .(pre-heating/heating/cooling)

Eutectic process inert gas anti-oxidation solution

Optimized bond head enable larger die support while maximizing production capacity 

Bond different-sized dies with precision using standard and flip-chip bonding solutions, featuring up to seven nozzles and five ejector pins for unmatched efficiency and flexibility.

Full automation: support automatic loading and production line

Improve force control accuracy and stability: Air-bearing structure in the center eliminates friction, awarded an invention patent

Compatible with dot dispensing and dip glue methods using pneumatic, piezoelectric, or screw valve configurations

Supports up to five dip glue heads with automatic switching (epoxy resin, silver paste)

Automatically switches between fourteen nozzles and five ejector pins to handle various chip/die sizes; supports both standard and flip-chip bonding for enhanced flexibility

Multi-layer dispensing capability for complex workflows

Enhanced force control accuracy and stability: Central air-bearing structure eliminates friction; awarded an invention patent